Sharing register file usage between fused processing resources

ABSTRACT

Embodiments described herein provide an apparatus comprising a plurality of processing resources including a first processing resource and a second processing resource, a shared local memory communicatively coupled to the first processing resource and the second processing resource, and a processor to receive an instruction to initiate a matrix multiplication operation, write a first set of matrix data into a first set of registers, and share the first set of matrix data between the first processing resource and the second processing resource for use in the matrix multiplication operation. Other embodiments may be described and claimed.

BACKGROUND

Subject matter described herein relates generally to electroniccomputing, and in some examples, to graphics processing.

Highly dense computations such a matrix multiplications are commonbuilding block operations in many Deep Learning (DL) and HighPerformance Computing (HPC) workloads. Such building block operationshave significant data reuse, both spatially and temporally. Often, theperformance of such building block operations is limited by the rate atwhich the data can be fed into the execution units of a processor, andsuch data movement is limited by the width and speeds of the buses thatconnect the execution units and the shared local memory.

Accordingly, techniques to improve data transfer speeds between memoryand execution units may find utility, e.g., in computing operations.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentembodiments can be understood in detail, a more particular descriptionof the embodiments, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments and are therefore not to be considered limiting ofits scope.

FIG. 1 is a block diagram of a processing system, according to accordingto some embodiments described herein;

FIG. 2A is a block diagram of a processor, according to according tosome embodiments described herein;

FIG. 2B is a block diagram of hardware logic of a graphics processorcore, according to some embodiments described herein;

FIG. 2C illustrates a graphics processing unit (GPU) that includesdedicated sets of graphics processing resources arranged into multi-coregroups, according to some embodiments described herein;

FIG. 2D is a block diagram of general purpose graphics processing unit(GPGPU) that can be configured as a graphics processor and/or computeaccelerator, according to some embodiments described herein.

FIG. 3A is a block diagram of a graphics processor, according toaccording to some embodiments described herein;

FIG. 3B illustrates a graphics processor having a tiled architecture,according to embodiments described herein;

FIG. 3C illustrates a compute accelerator, according to some embodimentsdescribed herein;

FIG. 4 is a block diagram of a graphics processing engine of a graphicsprocessor according to some embodiments described herein;

FIG. 5A is a block diagram of hardware logic of a graphics processorcore, according to some embodiments described herein;

FIG. 5B illustrates exemplary internal details of an execution unit,according to some embodiments described herein;

FIG. 6 illustrates an execution unit, according to an embodimentaccording to embodiments described herein;

FIG. 7 is a block diagram illustrating a graphics processor instructionformats according to some embodiments described herein;

FIG. 8 is a block diagram of a graphics processor according to someembodiments described herein;

FIG. 9A-9B illustrate a graphics processor command format and commandsequence, according to some embodiments described herein;

FIG. 10 illustrates exemplary graphics software architecture for a dataprocessing system according to some embodiments described herein;

FIG. 11A is a block diagram illustrating an IP core development system,according to some embodiments described herein;

FIG. 11B illustrates a cross-section side view of an integrated circuitpackage assembly, according to some embodiments described herein;

FIG. 11C illustrates a package assembly that includes multiple units ofhardware logic chiplets connected to a substrate, according to someembodiments described herein;

FIG. 11D illustrates a package assembly including interchangeablechiplets, according to some embodiments described herein;

FIG. 12 is a block diagram illustrating an exemplary system on a chipintegrated circuit, according to according to some embodiments describedherein;

FIGS. 13A-13B are block diagrams illustrating exemplary graphicsprocessors for use within an SoC, according to some embodimentsdescribed herein;

FIG. 14 illustrates a data processing system which may be adapted tosupport background estimation for object segmentation using coarse-leveltracking, according to some embodiments described herein;

FIG. 15 illustrates a machine learning software stack, according to someembodiments described herein;

FIGS. 16A-16B illustrate layers of exemplary deep neural networks,according to some embodiments described herein;

FIG. 17 illustrates an exemplary recurrent neural network, according tosome embodiments described herein;

FIG. 18 illustrates training and deployment of a deep neural network,according to embodiments described herein;

FIG. 19 is a block diagram illustrating distributed learning, accordingto embodiments described herein;

FIG. 20 is a schematic illustration of a matrix multiplicationoperation, according to some embodiments;

FIG. 21 is a schematic illustration of a matrix multiplicationoperation, according to some embodiments;

FIG. 22 is a block diagram which illustrates components of an apparatusto support matrix multiplication operations, according to someembodiments described herein;

FIG. 23 is a block diagram which illustrates components of an apparatusto support matrix multiplication operations, according to someembodiments described herein;

FIG. 24 is a flowchart which illustrates operations in a method tosupport matrix multiplication operations, according to some embodimentsdescribed herein;

FIG. 25 is a block diagram of a computing device including a graphicsprocessor, according to some embodiments described herein.

DESCRIPTION OF EMBODIMENTS

For the purposes of explanation, numerous specific details are set forthto provide a thorough understanding of the various embodiments describedbelow. However, it will be apparent to a skilled practitioner in the artthat the embodiments may be practiced without some of these specificdetails. In other instances, well-known structures and devices are shownin block diagram form to avoid obscuring the underlying principles, andto provide a more thorough understanding of embodiments. Although someof the following embodiments are described with reference to a graphicsprocessor, the techniques and teachings described herein may be appliedto various types of circuits or semiconductor devices, including generalpurpose processing devices or graphic processing devices. Referenceherein to “one embodiment” or “an embodiment” indicate that a particularfeature, structure, or characteristic described in connection orassociation with the embodiment can be included in at least one of suchembodiments. However, the appearances of the phrase “in one embodiment”in various places in the specification do not necessarily all refer tothe same embodiment.

In the following description and claims, the terms “coupled” and“connected,” along with their derivatives, may be used. It should beunderstood that these terms are not intended as synonyms for each other.“Coupled” is used to indicate that two or more elements, which may ormay not be in direct physical or electrical contact with each other,co-operate or interact with each other. “Connected” is used to indicatethe establishment of communication between two or more elements that arecoupled with each other.

In the description that follows, FIGS. 1-13B provide an overview ofexemplary data processing system and graphics processor logic thatincorporates or relates to the various embodiments. The remainingfigures provide specific details of the various embodiments. Someaspects of the following embodiments are described with reference to agraphics processor, while other aspects are described with respect to ageneral-purpose processor, such as a central processing unit (CPU).Similar techniques and teachings can be applied to other types ofcircuits or semiconductor devices, including but not limited to a manyintegrated core processor, a GPU cluster, or one or more instances of afield programmable gate array (FPGA). In general, the teachings areapplicable to any processor or machine that manipulates or processesimage (e.g., sample, pixel), vertex data, or geometry data.

System Overview

FIG. 1 is a block diagram of a processing system 100, according to anembodiment. System 100 may be used in a single processor desktop system,a multiprocessor workstation system, or a server system having a largenumber of processors 102 or processor cores 107. In one embodiment, thesystem 100 is a processing platform incorporated within asystem-on-a-chip (SoC) integrated circuit for use in mobile, handheld,or embedded devices such as within Internet-of-things (IoT) devices withwired or wireless connectivity to a local or wide area network.

In one embodiment, system 100 can include, couple with, or be integratedwithin: a server-based gaming platform; a game console, including a gameand media console; a mobile gaming console, a handheld game console, oran online game console. In some embodiments the system 100 is part of amobile phone, smart phone, tablet computing device or mobileInternet-connected device such as a laptop with low internal storagecapacity. Processing system 100 can also include, couple with, or beintegrated within: a wearable device, such as a smart watch wearabledevice; smart eyewear or clothing enhanced with augmented reality (AR)or virtual reality (VR) features to provide visual, audio or tactileoutputs to supplement real world visual, audio or tactile experiences orotherwise provide text, audio, graphics, video, holographic images orvideo, or tactile feedback; other augmented reality (AR) device; orother virtual reality (VR) device. In some embodiments, the processingsystem 100 includes or is part of a television or set top box device. Inone embodiment, system 100 can include, couple with, or be integratedwithin a self-driving vehicle such as a bus, tractor trailer, car, motoror electric power cycle, plane or glider (or any combination thereof).The self-driving vehicle may use system 100 to process the environmentsensed around the vehicle.

In some embodiments, the one or more processors 102 each include one ormore processor cores 107 to process instructions which, when executed,perform operations for system or user software. In some embodiments, atleast one of the one or more processor cores 107 is configured toprocess a specific instruction set 109. In some embodiments, instructionset 109 may facilitate Complex Instruction Set Computing (CISC), ReducedInstruction Set Computing (RISC), or computing via a Very LongInstruction Word (VLIW). One or more processor cores 107 may process adifferent instruction set 109, which may include instructions tofacilitate the emulation of other instruction sets. Processor core 107may also include other processing devices, such as a Digital SignalProcessor (DSP).

In some embodiments, the processor 102 includes cache memory 104.Depending on the architecture, the processor 102 can have a singleinternal cache or multiple levels of internal cache. In someembodiments, the cache memory is shared among various components of theprocessor 102. In some embodiments, the processor 102 also uses anexternal cache (e.g., a Level-3 (L3) cache or Last Level Cache (LLC))(not shown), which may be shared among processor cores 107 using knowncache coherency techniques. A register file 106 can be additionallyincluded in processor 102 and may include different types of registersfor storing different types of data (e.g., integer registers, floatingpoint registers, status registers, and an instruction pointer register).Some registers may be general-purpose registers, while other registersmay be specific to the design of the processor 102.

In some embodiments, one or more processor(s) 102 are coupled with oneor more interface bus(es) 110 to transmit communication signals such asaddress, data, or control signals between processor 102 and othercomponents in the system 100. The interface bus 110, in one embodiment,can be a processor bus, such as a version of the Direct Media Interface(DMI) bus. However, processor busses are not limited to the DMI bus, andmay include one or more Peripheral Component Interconnect buses (e.g.,PCI, PCI express), memory busses, or other types of interface busses. Inone embodiment the processor(s) 102 include an integrated memorycontroller 116 and a platform controller hub 130. The memory controller116 facilitates communication between a memory device and othercomponents of the system 100, while the platform controller hub (PCH)130 provides connections to I/O devices via a local I/O bus.

The memory device 120 can be a dynamic random-access memory (DRAM)device, a static random-access memory (SRAM) device, flash memorydevice, phase-change memory device, or some other memory device havingsuitable performance to serve as process memory. In one embodiment thememory device 120 can operate as system memory for the system 100, tostore data 122 and instructions 121 for use when the one or moreprocessors 102 executes an application or process. Memory controller 116also couples with an optional external graphics processor 118, which maycommunicate with the one or more graphics processors 108 in processors102 to perform graphics and media operations. In some embodiments,graphics, media, and or compute operations may be assisted by anaccelerator 112 which is a coprocessor that can be configured to performa specialized set of graphics, media, or compute operations. Forexample, in one embodiment the accelerator 112 is a matrixmultiplication accelerator used to optimize machine learning or computeoperations. In one embodiment the accelerator 112 is a ray-tracingaccelerator that can be used to perform ray-tracing operations inconcert with the graphics processor 108. In one embodiment, an externalaccelerator 119 may be used in place of or in concert with theaccelerator 112.

In some embodiments a display device 111 can connect to the processor(s)102. The display device 111 can be one or more of an internal displaydevice, as in a mobile electronic device or a laptop device or anexternal display device attached via a display interface (e.g.,DisplayPort, etc.). In one embodiment the display device 111 can be ahead mounted display (HMD) such as a stereoscopic display device for usein virtual reality (VR) applications or augmented reality (AR)applications.

In some embodiments the platform controller hub 130 enables peripheralsto connect to memory device 120 and processor 102 via a high-speed I/Obus. The I/O peripherals include, but are not limited to, an audiocontroller 146, a network controller 134, a firmware interface 128, awireless transceiver 126, touch sensors 125, a data storage device 124(e.g., non-volatile memory, volatile memory, hard disk drive, flashmemory, NAND, 3D NAND, 3D XPoint, etc.). The data storage device 124 canconnect via a storage interface (e.g., SATA) or via a peripheral bus,such as a Peripheral Component Interconnect bus (e.g., PCI, PCIexpress). The touch sensors 125 can include touch screen sensors,pressure sensors, or fingerprint sensors. The wireless transceiver 126can be a Wi-Fi transceiver, a Bluetooth transceiver, or a mobile networktransceiver such as a 3G, 4G, 5G, or Long-Term Evolution (LTE)transceiver. The firmware interface 128 enables communication withsystem firmware, and can be, for example, a unified extensible firmwareinterface (UEFI). The network controller 134 can enable a networkconnection to a wired network. In some embodiments, a high-performancenetwork controller (not shown) couples with the interface bus 110. Theaudio controller 146, in one embodiment, is a multi-channel highdefinition audio controller. In one embodiment the system 100 includesan optional legacy I/O controller 140 for coupling legacy (e.g.,Personal System 2 (PS/2)) devices to the system. The platform controllerhub 130 can also connect to one or more Universal Serial Bus (USB)controllers 142 connect input devices, such as keyboard and mouse 143combinations, a camera 144, or other USB input devices.

It will be appreciated that the system 100 shown is exemplary and notlimiting, as other types of data processing systems that are differentlyconfigured may also be used. For example, an instance of the memorycontroller 116 and platform controller hub 130 may be integrated into adiscreet external graphics processor, such as the external graphicsprocessor 118. In one embodiment the platform controller hub 130 and/ormemory controller 116 may be external to the one or more processor(s)102. For example, the system 100 can include an external memorycontroller 116 and platform controller hub 130, which may be configuredas a memory controller hub and peripheral controller hub within a systemchipset that is in communication with the processor(s) 102.

For example, circuit boards (“sleds”) can be used on which componentssuch as CPUs, memory, and other components are placed are designed forincreased thermal performance In some examples, processing componentssuch as the processors are located on a top side of a sled while nearmemory, such as DIMMs, are located on a bottom side of the sled. As aresult of the enhanced airflow provided by this design, the componentsmay operate at higher frequencies and power levels than in typicalsystems, thereby increasing performance. Furthermore, the sleds areconfigured to blindly mate with power and data communication cables in arack, thereby enhancing their ability to be quickly removed, upgraded,reinstalled, and/or replaced. Similarly, individual components locatedon the sleds, such as processors, accelerators, memory, and data storagedrives, are configured to be easily upgraded due to their increasedspacing from each other. In the illustrative embodiment, the componentsadditionally include hardware attestation features to prove theirauthenticity.

A data center can utilize a single network architecture (“fabric”) thatsupports multiple other network architectures including Ethernet andOmni-Path. The sleds can be coupled to switches via optical fibers,which provide higher bandwidth and lower latency than typical twistedpair cabling (e.g., Category 5, Category 5e, Category 6, etc.). Due tothe high bandwidth, low latency interconnections and networkarchitecture, the data center may, in use, pool resources, such asmemory, accelerators (e.g., GPUs, graphics accelerators, FPGAs, ASICs,neural network and/or artificial intelligence accelerators, etc.), anddata storage drives that are physically disaggregated, and provide themto compute resources (e.g., processors) on an as needed basis, enablingthe compute resources to access the pooled resources as if they werelocal.

A power supply or source can provide voltage and/or current to system100 or any component or system described herein. In one example, thepower supply includes an AC to DC (alternating current to directcurrent) adapter to plug into a wall outlet. Such AC power can berenewable energy (e.g., solar power) power source. In one example, powersource includes a DC power source, such as an external AC to DCconverter. In one example, power source or power supply includeswireless charging hardware to charge via proximity to a charging field.In one example, power source can include an internal battery,alternating current supply, motion-based power supply, solar powersupply, or fuel cell source.

FIGS. 2A-2D illustrate computing systems and graphics processorsprovided by embodiments described herein. The elements of FIGS. 2A-2Dhaving the same reference numbers (or names) as the elements of anyother figure herein can operate or function in any manner similar tothat described elsewhere herein, but are not limited to such.

FIG. 2A is a block diagram of an embodiment of a processor 200 havingone or more processor cores 202A-202N, an integrated memory controller214, and an integrated graphics processor 208. Processor 200 can includeadditional cores up to and including additional core 202N represented bythe dashed lined boxes. Each of processor cores 202A-202N includes oneor more internal cache units 204A-204N. In some embodiments eachprocessor core also has access to one or more shared cached units 206.The internal cache units 204A-204N and shared cache units 206 representa cache memory hierarchy within the processor 200. The cache memoryhierarchy may include at least one level of instruction and data cachewithin each processor core and one or more levels of shared mid-levelcache, such as a Level 2 (L2), Level 3 (L3), Level 4 (L4), or otherlevels of cache, where the highest level of cache before external memoryis classified as the LLC. In some embodiments, cache coherency logicmaintains coherency between the various cache units 206 and 204A-204N.

In some embodiments, processor 200 may also include a set of one or morebus controller units 216 and a system agent core 210. The one or morebus controller units 216 manage a set of peripheral buses, such as oneor more PCI or PCI express busses. System agent core 210 providesmanagement functionality for the various processor components. In someembodiments, system agent core 210 includes one or more integratedmemory controllers 214 to manage access to various external memorydevices (not shown).

In some embodiments, one or more of the processor cores 202A-202Ninclude support for simultaneous multi-threading. In such embodiment,the system agent core 210 includes components for coordinating andoperating cores 202A-202N during multi-threaded processing. System agentcore 210 may additionally include a power control unit (PCU), whichincludes logic and components to regulate the power state of processorcores 202A-202N and graphics processor 208.

In some embodiments, processor 200 additionally includes graphicsprocessor 208 to execute graphics processing operations. In someembodiments, the graphics processor 208 couples with the set of sharedcache units 206, and the system agent core 210, including the one ormore integrated memory controllers 214. In some embodiments, the systemagent core 210 also includes a display controller 211 to drive graphicsprocessor output to one or more coupled displays. In some embodiments,display controller 211 may also be a separate module coupled with thegraphics processor via at least one interconnect, or may be integratedwithin the graphics processor 208.

In some embodiments, a ring-based interconnect unit 212 is used tocouple the internal components of the processor 200. However, analternative interconnect unit may be used, such as a point-to-pointinterconnect, a switched interconnect, or other techniques, includingtechniques well known in the art. In some embodiments, graphicsprocessor 208 couples with the ring interconnect 212 via an I/O link213.

The exemplary I/O link 213 represents at least one of multiple varietiesof I/O interconnects, including an on package I/O interconnect whichfacilitates communication between various processor components and ahigh-performance embedded memory module 218, such as an eDRAM module. Insome embodiments, each of the processor cores 202A-202N and graphicsprocessor 208 can use embedded memory modules 218 as a shared Last LevelCache.

In some embodiments, processor cores 202A-202N are homogenous coresexecuting the same instruction set architecture. In another embodiment,processor cores 202A-202N are heterogeneous in terms of instruction setarchitecture (ISA), where one or more of processor cores 202A-202Nexecute a first instruction set, while at least one of the other coresexecutes a subset of the first instruction set or a differentinstruction set. In one embodiment, processor cores 202A-202N areheterogeneous in terms of microarchitecture, where one or more coreshaving a relatively higher power consumption couple with one or morepower cores having a lower power consumption. In one embodiment,processor cores 202A-202N are heterogeneous in terms of computationalcapability. Additionally, processor 200 can be implemented on one ormore chips or as an SoC integrated circuit having the illustratedcomponents, in addition to other components.

FIG. 2B is a block diagram of hardware logic of a graphics processorcore 219, according to some embodiments described herein. Elements ofFIG. 2B having the same reference numbers (or names) as the elements ofany other figure herein can operate or function in any manner similar tothat described elsewhere herein, but are not limited to such. Thegraphics processor core 219, sometimes referred to as a core slice, canbe one or multiple graphics cores within a modular graphics processor.The graphics processor core 219 is exemplary of one graphics core slice,and a graphics processor as described herein may include multiplegraphics core slices based on target power and performance envelopes.Each graphics processor core 219 can include a fixed function block 230coupled with multiple sub-cores 221A-221F, also referred to assub-slices, that include modular blocks of general-purpose and fixedfunction logic.

In some embodiments, the fixed function block 230 includes ageometry/fixed function pipeline 231 that can be shared by all sub-coresin the graphics processor core 219, for example, in lower performanceand/or lower power graphics processor implementations. In variousembodiments, the geometry/fixed function pipeline 231 includes a 3Dfixed function pipeline (e.g., 3D pipeline 312 as in FIG. 3 and FIG. 4,described below) a video front-end unit, a thread spawner and threaddispatcher, and a unified return buffer manager, which manages unifiedreturn buffers (e.g., unified return buffer 418 in FIG. 4, as describedbelow).

In one embodiment the fixed function block 230 also includes a graphicsSoC interface 232, a graphics microcontroller 233, and a media pipeline234. The graphics SoC interface 232 provides an interface between thegraphics processor core 219 and other processor cores within a system ona chip integrated circuit. The graphics microcontroller 233 is aprogrammable sub-processor that is configurable to manage variousfunctions of the graphics processor core 219, including thread dispatch,scheduling, and pre-emption. The media pipeline 234 (e.g., mediapipeline 316 of FIG. 3 and FIG. 4) includes logic to facilitate thedecoding, encoding, pre-processing, and/or post-processing of multimediadata, including image and video data. The media pipeline 234 implementmedia operations via requests to compute or sampling logic within thesub-cores 221-221F.

In one embodiment the SoC interface 232 enables the graphics processorcore 219 to communicate with general-purpose application processor cores(e.g., CPUs) and/or other components within an SoC, including memoryhierarchy elements such as a shared last level cache memory, the systemRAM, and/or embedded on-chip or on-package DRAM. The SoC interface 232can also enable communication with fixed function devices within theSoC, such as camera imaging pipelines, and enables the use of and/orimplements global memory atomics that may be shared between the graphicsprocessor core 219 and CPUs within the SoC. The SoC interface 232 canalso implement power management controls for the graphics processor core219 and enable an interface between a clock domain of the graphic core219 and other clock domains within the SoC. In one embodiment the SoCinterface 232 enables receipt of command buffers from a command streamerand global thread dispatcher that are configured to provide commands andinstructions to each of one or more graphics cores within a graphicsprocessor. The commands and instructions can be dispatched to the mediapipeline 234, when media operations are to be performed, or a geometryand fixed function pipeline (e.g., geometry and fixed function pipeline231, geometry and fixed function pipeline 237) when graphics processingoperations are to be performed.

The graphics microcontroller 233 can be configured to perform variousscheduling and management tasks for the graphics processor core 219. Inone embodiment the graphics microcontroller 233 can perform graphicsand/or compute workload scheduling on the various graphics parallelengines within execution unit (EU) arrays 222A-222F, 224A-224F withinthe sub-cores 221A-221F. In this scheduling model, host softwareexecuting on a CPU core of an SoC including the graphics processor core219 can submit workloads one of multiple graphic processor doorbells,which invokes a scheduling operation on the appropriate graphics engine.Scheduling operations include determining which workload to run next,submitting a workload to a command streamer, pre-empting existingworkloads running on an engine, monitoring progress of a workload, andnotifying host software when a workload is complete. In one embodimentthe graphics microcontroller 233 can also facilitate low-power or idlestates for the graphics processor core 219, providing the graphicsprocessor core 219 with the ability to save and restore registers withinthe graphics processor core 219 across low-power state transitionsindependently from the operating system and/or graphics driver softwareon the system.

The graphics processor core 219 may have greater than or fewer than theillustrated sub-cores 221A-221F, up to N modular sub-cores. For each setof N sub-cores, the graphics processor core 219 can also include sharedfunction logic 235, shared and/or cache memory 236, a geometry/fixedfunction pipeline 237, as well as additional fixed function logic 238 toaccelerate various graphics and compute processing operations. Theshared function logic 235 can include logic units associated with theshared function logic 420 of FIG. 4 (e.g., sampler, math, and/orinter-thread communication logic) that can be shared by each N sub-coreswithin the graphics processor core 219. The shared and/or cache memory236 can be a last-level cache for the set of N sub-cores 221A-221Fwithin the graphics processor core 219, and can also serve as sharedmemory that is accessible by multiple sub-cores. The geometry/fixedfunction pipeline 237 can be included instead of the geometry/fixedfunction pipeline 231 within the fixed function block 230 and caninclude the same or similar logic units.

In one embodiment the graphics processor core 219 includes additionalfixed function logic 238 that can include various fixed functionacceleration logic for use by the graphics processor core 219. In oneembodiment the additional fixed function logic 238 includes anadditional geometry pipeline for use in position only shading. Inposition-only shading, two geometry pipelines exist, the full geometrypipeline within the geometry/fixed function pipeline 238, 231, and acull pipeline, which is an additional geometry pipeline which may beincluded within the additional fixed function logic 238. In oneembodiment the cull pipeline is a trimmed down version of the fullgeometry pipeline. The full pipeline and the cull pipeline can executedifferent instances of the same application, each instance having aseparate context. Position only shading can hide long cull runs ofdiscarded triangles, enabling shading to be completed earlier in someinstances. For example and in one embodiment the cull pipeline logicwithin the additional fixed function logic 238 can execute positionshaders in parallel with the main application and generally generatescritical results faster than the full pipeline, as the cull pipelinefetches and shades only the position attribute of the vertices, withoutperforming rasterization and rendering of the pixels to the framebuffer. The cull pipeline can use the generated critical results tocompute visibility information for all the triangles without regard towhether those triangles are culled. The full pipeline (which in thisinstance may be referred to as a replay pipeline) can consume thevisibility information to skip the culled triangles to shade only thevisible triangles that are finally passed to the rasterization phase.

In one embodiment the additional fixed function logic 238 can alsoinclude machine-learning acceleration logic, such as fixed functionmatrix multiplication logic, for implementations including optimizationsfor machine learning training or inferencing.

Within each graphics sub-core 221A-221F includes a set of executionresources that may be used to perform graphics, media, and computeoperations in response to requests by graphics pipeline, media pipeline,or shader programs. The graphics sub-cores 221A-221F include multiple EUarrays 222A-222F, 224A-224F, thread dispatch and inter-threadcommunication (TD/IC) logic 223A-223F, a 3D (e.g., texture) sampler225A-225F, a media sampler 206A-206F, a shader processor 227A-227F, andshared local memory (SLM) 228A-228F. The EU arrays 222A-222F, 224A-224Feach include multiple execution units, which are general-purposegraphics processing units capable of performing floating-point andinteger/fixed-point logic operations in service of a graphics, media, orcompute operation, including graphics, media, or compute shaderprograms. The TD/IC logic 223A-223F performs local thread dispatch andthread control operations for the execution units within a sub-core andfacilitate communication between threads executing on the executionunits of the sub-core. The 3D sampler 225A-225F can read texture orother 3D graphics related data into memory. The 3D sampler can readtexture data differently based on a configured sample state and thetexture format associated with a given texture. The media sampler206A-206F can perform similar read operations based on the type andformat associated with media data. In one embodiment, each graphicssub-core 221A-221F can alternately include a unified 3D and mediasampler. Threads executing on the execution units within each of thesub-cores 221A-221F can make use of shared local memory 228A-228F withineach sub-core, to enable threads executing within a thread group toexecute using a common pool of on-chip memory.

FIG. 2C illustrates a graphics processing unit (GPU) 239 that includesdedicated sets of graphics processing resources arranged into multi-coregroups 240A-240N. While the details of only a single multi-core group240A are provided, it will be appreciated that the other multi-coregroups 240B-240N may be equipped with the same or similar sets ofgraphics processing resources.

As illustrated, a multi-core group 240A may include a set of graphicscores 243, a set of tensor cores 244, and a set of ray tracing cores245. A scheduler/dispatcher 241 schedules and dispatches the graphicsthreads for execution on the various cores 243, 244, 245. A set ofregister files 242 store operand values used by the cores 243, 244, 245when executing the graphics threads. These may include, for example,integer registers for storing integer values, floating point registersfor storing floating point values, vector registers for storing packeddata elements (integer and/or floating point data elements) and tileregisters for storing tensor/matrix values. In one embodiment, the tileregisters are implemented as combined sets of vector registers.

One or more combined level 1 (L1) caches and shared memory units 247store graphics data such as texture data, vertex data, pixel data, raydata, bounding volume data, etc., locally within each multi-core group240A. One or more texture units 247 can also be used to performtexturing operations, such as texture mapping and sampling. A Level 2(L2) cache 253 shared by all or a subset of the multi-core groups240A-240N stores graphics data and/or instructions for multipleconcurrent graphics threads. As illustrated, the L2 cache 253 may beshared across a plurality of multi-core groups 240A-240N. One or morememory controllers 248 couple the GPU 239 to a memory 249 which may be asystem memory (e.g., DRAM) and/or a dedicated graphics memory (e.g.,GDDR6 memory).

Input/output (I/O) circuitry 250 couples the GPU 239 to one or more I/Odevices 252 such as digital signal processors (DSPs), networkcontrollers, or user input devices. An on-chip interconnect may be usedto couple the I/O devices 252 to the GPU 239 and memory 249. One or moreI/O memory management units (IOMMUs) 251 of the I/O circuitry 250 couplethe I/O devices 252 directly to the system memory 249. In oneembodiment, the IOMMU 251 manages multiple sets of page tables to mapvirtual addresses to physical addresses in system memory 249. In thisembodiment, the I/O devices 252, CPU(s) 246, and GPU(s) 239 may sharethe same virtual address space.

In one implementation, the IOMMU 251 supports virtualization. In thiscase, it may manage a first set of page tables to map guest/graphicsvirtual addresses to guest/graphics physical addresses and a second setof page tables to map the guest/graphics physical addresses tosystem/host physical addresses (e.g., within system memory 249). Thebase addresses of each of the first and second sets of page tables maybe stored in control registers and swapped out on a context switch(e.g., so that the new context is provided with access to the relevantset of page tables). While not illustrated in FIG. 2C, each of the cores243, 244, 245 and/or multi-core groups 240A-240N may include translationlookaside buffers (TLBs) to cache guest virtual to guest physicaltranslations, guest physical to host physical translations, and guestvirtual to host physical translations.

In one embodiment, the CPUs 246, GPUs 239, and I/O devices 252 areintegrated on a single semiconductor chip and/or chip package. Theillustrated memory 249 may be integrated on the same chip or may becoupled to the memory controllers 248 via an off-chip interface. In oneimplementation, the memory 249 comprises GDDR6 memory which shares thesame virtual address space as other physical system-level memories,although the underlying principles of the invention are not limited tothis specific implementation.

In one embodiment, the tensor cores 244 include a plurality of executionunits specifically designed to perform matrix operations, which are thefundamental compute operation used to perform deep learning operations.For example, simultaneous matrix multiplication operations may be usedfor neural network training and inferencing. The tensor cores 244 mayperform matrix processing using a variety of operand precisionsincluding single precision floating-point (e.g., 32 bits),half-precision floating point (e.g., 16 bits), integer words (16 bits),bytes (8 bits), and half-bytes (4 bits). In one embodiment, a neuralnetwork implementation extracts features of each rendered scene,potentially combining details from multiple frames, to construct ahigh-quality final image.

In deep learning implementations, parallel matrix multiplication workmay be scheduled for execution on the tensor cores 244. The training ofneural networks, in particular, requires a significant number matrix dotproduct operations. In order to process an inner-product formulation ofan N×N×N matrix multiply, the tensor cores 244 may include at least Ndot-product processing elements. Before the matrix multiply begins, oneentire matrix is loaded into tile registers and at least one column of asecond matrix is loaded each cycle for N cycles. Each cycle, there are Ndot products that are processed.

Matrix elements may be stored at different precisions depending on theparticular implementation, including 16-bit words, 8-bit bytes (e.g.,INT8) and 4-bit half-bytes (e.g., INT4). Different precision modes maybe specified for the tensor cores 244 to ensure that the most efficientprecision is used for different workloads (e.g., such as inferencingworkloads which can tolerate quantization to bytes and half-bytes).

In one embodiment, the ray tracing cores 245 accelerate ray tracingoperations for both real-time ray tracing and non-real-time ray tracingimplementations. In particular, the ray tracing cores 245 include raytraversal/intersection circuitry for performing ray traversal usingbounding volume hierarchies (BVHs) and identifying intersections betweenrays and primitives enclosed within the BVH volumes. The ray tracingcores 245 may also include circuitry for performing depth testing andculling (e.g., using a Z buffer or similar arrangement). In oneimplementation, the ray tracing cores 245 perform traversal andintersection operations in concert with the image denoising techniquesdescribed herein, at least a portion of which may be executed on thetensor cores 244. For example, in one embodiment, the tensor cores 244implement a deep learning neural network to perform denoising of framesgenerated by the ray tracing cores 245. However, the CPU(s) 246,graphics cores 243, and/or ray tracing cores 245 may also implement allor a portion of the denoising and/or deep learning algorithms.

In addition, as described above, a distributed approach to denoising maybe employed in which the GPU 239 is in a computing device coupled toother computing devices over a network or high speed interconnect. Inthis embodiment, the interconnected computing devices share neuralnetwork learning/training data to improve the speed with which theoverall system learns to perform denoising for different types of imageframes and/or different graphics applications.

In one embodiment, the ray tracing cores 245 process all BVH traversaland ray-primitive intersections, saving the graphics cores 243 frombeing overloaded with thousands of instructions per ray. In oneembodiment, each ray tracing core 245 includes a first set ofspecialized circuitry for performing bounding box tests (e.g., fortraversal operations) and a second set of specialized circuitry forperforming the ray-triangle intersection tests (e.g., intersecting rayswhich have been traversed). Thus, in one embodiment, the multi-coregroup 240A can simply launch a ray probe, and the ray tracing cores 245independently perform ray traversal and intersection and return hit data(e.g., a hit, no hit, multiple hits, etc.) to the thread context. Theother cores 243, 244 are freed to perform other graphics or compute workwhile the ray tracing cores 245 perform the traversal and intersectionoperations.

In one embodiment, each ray tracing core 245 includes a traversal unitto perform BVH testing operations and an intersection unit whichperforms ray-primitive intersection tests. The intersection unitgenerates a “hit”, “no hit”, or “multiple hit” response, which itprovides to the appropriate thread. During the traversal andintersection operations, the execution resources of the other cores(e.g., graphics cores 243 and tensor cores 244) are freed to performother forms of graphics work.

In one particular embodiment described below, a hybrid rasterization/raytracing approach is used in which work is distributed between thegraphics cores 243 and ray tracing cores 245.

In one embodiment, the ray tracing cores 245 (and/or other cores 243,244) include hardware support for a ray tracing instruction set such asMicrosoft's DirectX Ray Tracing (DXR) which includes a DispatchRayscommand, as well as ray-generation, closest-hit, any-hit, and missshaders, which enable the assignment of unique sets of shaders andtextures for each object. Another ray tracing platform which may besupported by the ray tracing cores 245, graphics cores 243 and tensorcores 244 is Vulkan 1.1.85. Note, however, that the underlyingprinciples of the invention are not limited to any particular raytracing ISA.

In general, the various cores 245, 244, 243 may support a ray tracinginstruction set that includes instructions/functions for ray generation,closest hit, any hit, ray-primitive intersection, per-primitive andhierarchical bounding box construction, miss, visit, and exceptions.More specifically, one embodiment includes ray tracing instructions toperform the following functions:

Ray Generation—Ray generation instructions may be executed for eachpixel, sample, or other user-defined work assignment.

Closest Hit—A closest hit instruction may be executed to locate theclosest intersection point of a ray with primitives within a scene.

Any Hit—An any hit instruction identifies multiple intersections betweena ray and primitives within a scene, potentially to identify a newclosest intersection point.

Intersection—An intersection instruction performs a ray-primitiveintersection test and outputs a result.

Per-primitive Bounding box Construction—This instruction builds abounding box around a given primitive or group of primitives (e.g., whenbuilding a new BVH or other acceleration data structure).

Miss—Indicates that a ray misses all geometry within a scene, orspecified region of a scene.

Visit—Indicates the children volumes a ray will traverse.

Exceptions—Includes various types of exception handlers (e.g., invokedfor various error conditions).

FIG. 2D is a block diagram of general purpose graphics processing unit(GPGPU) 270 that can be configured as a graphics processor and/orcompute accelerator, according to embodiments described herein. TheGPGPU 270 can interconnect with host processors (e.g., one or moreCPU(s) 246) and memory 271, 272 via one or more system and/or memorybusses. In one embodiment the memory 271 is system memory that may beshared with the one or more CPU(s) 246, while memory 272 is devicememory that is dedicated to the GPGPU 270. In one embodiment, componentswithin the GPGPU 270 and device memory 272 may be mapped into memoryaddresses that are accessible to the one or more CPU(s) 246. Access tomemory 271 and 272 may be facilitated via a memory controller 268. Inone embodiment the memory controller 268 includes an internal directmemory access (DMA) controller 269 or can include logic to performoperations that would otherwise be performed by a DMA controller.

The GPGPU 270 includes multiple cache memories, including an L2 cache253, L1 cache 254, an instruction cache 255, and shared memory 256, atleast a portion of which may also be partitioned as a cache memory. TheGPGPU 270 also includes multiple compute units 260A-260N. Each computeunit 260A-260N includes a set of vector registers 261, scalar registers262, vector logic units 263, and scalar logic units 264. The computeunits 260A-260N can also include local shared memory 265 and a programcounter 266. The compute units 260A-260N can couple with a constantcache 267, which can be used to store constant data, which is data thatwill not change during the run of kernel or shader program that executeson the GPGPU 270. In one embodiment the constant cache 267 is a scalardata cache and cached data can be fetched directly into the scalarregisters 262.

During operation, the one or more CPU(s) 246 can write commands intoregisters or memory in the GPGPU 270 that has been mapped into anaccessible address space. The command processors 257 can read thecommands from registers or memory and determine how those commands willbe processed within the GPGPU 270. A thread dispatcher 258 can then beused to dispatch threads to the compute units 260A-260N to perform thosecommands Each compute unit 260A-260N can execute threads independentlyof the other compute units. Additionally each compute unit 260A-260N canbe independently configured for conditional computation and canconditionally output the results of computation to memory. The commandprocessors 257 can interrupt the one or more CPU(s) 246 when thesubmitted commands are complete.

FIGS. 3A-3C illustrate block diagrams of additional graphics processorand compute accelerator architectures provided by embodiments describedherein. The elements of FIGS. 3A-3C having the same reference numbers(or names) as the elements of any other figure herein can operate orfunction in any manner similar to that described elsewhere herein, butare not limited to such.

FIG. 3A is a block diagram of a graphics processor 300, which may be adiscrete graphics processing unit, or may be a graphics processorintegrated with a plurality of processing cores, or other semiconductordevices such as, but not limited to, memory devices or networkinterfaces. In some embodiments, the graphics processor communicates viaa memory mapped I/O interface to registers on the graphics processor andwith commands placed into the processor memory. In some embodiments,graphics processor 300 includes a memory interface 314 to access memory.Memory interface 314 can be an interface to local memory, one or moreinternal caches, one or more shared external caches, and/or to systemmemory.

In some embodiments, graphics processor 300 also includes a displaycontroller 302 to drive display output data to a display device 318.Display controller 302 includes hardware for one or more overlay planesfor the display and composition of multiple layers of video or userinterface elements. The display device 318 can be an internal orexternal display device. In one embodiment the display device 318 is ahead mounted display device, such as a virtual reality (VR) displaydevice or an augmented reality (AR) display device. In some embodiments,graphics processor 300 includes a video codec engine 306 to encode,decode, or transcode media to, from, or between one or more mediaencoding formats, including, but not limited to Moving Picture ExpertsGroup (MPEG) formats such as MPEG-2, Advanced Video Coding (AVC) formatssuch as H.264/MPEG-4 AVC, H.265/HEVC, Alliance for Open Media (AOMedia)VP8, VP9, as well as the Society of Motion Picture & TelevisionEngineers (SMPTE) 421M/VC-1, and Joint Photographic Experts Group (JPEG)formats such as JPEG, and Motion JPEG (MJPEG) formats.

In some embodiments, graphics processor 300 includes a block imagetransfer (BLIT) engine 304 to perform two-dimensional (2D) rasterizeroperations including, for example, bit-boundary block transfers.However, in one embodiment, 2D graphics operations are performed usingone or more components of graphics processing engine (GPE) 310. In someembodiments, GPE 310 is a compute engine for performing graphicsoperations, including three-dimensional (3D) graphics operations andmedia operations.

In some embodiments, GPE 310 includes a 3D pipeline 312 for performing3D operations, such as rendering three-dimensional images and scenesusing processing functions that act upon 3D primitive shapes (e.g.,rectangle, triangle, etc.). The 3D pipeline 312 includes programmableand fixed function elements that perform various tasks within theelement and/or spawn execution threads to a 3D/Media sub-system 315.While 3D pipeline 312 can be used to perform media operations, anembodiment of GPE 310 also includes a media pipeline 316 that isspecifically used to perform media operations, such as videopost-processing and image enhancement.

In some embodiments, media pipeline 316 includes fixed function orprogrammable logic units to perform one or more specialized mediaoperations, such as video decode acceleration, video de-interlacing, andvideo encode acceleration in place of, or on behalf of video codecengine 306. In some embodiments, media pipeline 316 additionallyincludes a thread spawning unit to spawn threads for execution on3D/Media sub-system 315. The spawned threads perform computations forthe media operations on one or more graphics execution units included in3D/Media sub-system 315.

In some embodiments, 3D/Media subsystem 315 includes logic for executingthreads spawned by 3D pipeline 312 and media pipeline 316. In oneembodiment, the pipelines send thread execution requests to 3D/Mediasubsystem 315, which includes thread dispatch logic for arbitrating anddispatching the various requests to available thread executionresources. The execution resources include an array of graphicsexecution units to process the 3D and media threads. In someembodiments, 3D/Media subsystem 315 includes one or more internal cachesfor thread instructions and data. In some embodiments, the subsystemalso includes shared memory, including registers and addressable memory,to share data between threads and to store output data.

FIG. 3B illustrates a graphics processor 320 having a tiledarchitecture, according to embodiments described herein. In oneembodiment the graphics processor 320 includes a graphics processingengine cluster 322 having multiple instances of the graphics processingengine 310 of FIG. 3A within a graphics engine tile 310A-310D. Eachgraphics engine tile 310A-310D can be interconnected via a set of tileinterconnects 323A-323F. Each graphics engine tile 310A-310D can also beconnected to a memory module or memory device 326A-326D via memoryinterconnects 325A-325D. The memory devices 326A-326D can use anygraphics memory technology. For example, the memory devices 326A-326Dmay be graphics double data rate (GDDR) memory. The memory devices326A-326D, in one embodiment, are high-bandwidth memory (HBM) modulesthat can be on-die with their respective graphics engine tile 310A-310D.In one embodiment the memory devices 326A-326D are stacked memorydevices that can be stacked on top of their respective graphics enginetile 310A-310D. In one embodiment, each graphics engine tile 310A-310Dand associated memory 326A-326D reside on separate chiplets, which arebonded to a base die or base substrate, as described on further detailin FIGS. 11B-11D.

The graphics processing engine cluster 322 can connect with an on-chipor on-package fabric interconnect 324. The fabric interconnect 324 canenable communication between graphics engine tiles 310A-310D andcomponents such as the video codec 306 and one or more copy engines 304.The copy engines 304 can be used to move data out of, into, and betweenthe memory devices 326A-326D and memory that is external to the graphicsprocessor 320 (e.g., system memory). The fabric interconnect 324 canalso be used to interconnect the graphics engine tiles 310A-310D. Thegraphics processor 320 may optionally include a display controller 302to enable a connection with an external display device 318. The graphicsprocessor may also be configured as a graphics or compute accelerator.In the accelerator configuration, the display controller 302 and displaydevice 318 may be omitted.

The graphics processor 320 can connect to a host system via a hostinterface 328. The host interface 328 can enable communication betweenthe graphics processor 320, system memory, and/or other systemcomponents. The host interface 328 can be, for example a PCI express busor another type of host system interface.

FIG. 3C illustrates a compute accelerator 330, according to embodimentsdescribed herein. The compute accelerator 330 can include architecturalsimilarities with the graphics processor 320 of FIG. 3B and is optimizedfor compute acceleration. A compute engine cluster 332 can include a setof compute engine tiles 340A-340D that include execution logic that isoptimized for parallel or vector-based general-purpose computeoperations. In some embodiments, the compute engine tiles 340A-340D donot include fixed function graphics processing logic, although in oneembodiment one or more of the compute engine tiles 340A-340D can includelogic to perform media acceleration. The compute engine tiles 340A-340Dcan connect to memory 326A-326D via memory interconnects 325A-325D. Thememory 326A-326D and memory interconnects 325A-325D may be similartechnology as in graphics processor 320, or can be different. Thegraphics compute engine tiles 340A-340D can also be interconnected via aset of tile interconnects 323A-323F and may be connected with and/orinterconnected by a fabric interconnect 324. In one embodiment thecompute accelerator 330 includes a large L3 cache 336 that can beconfigured as a device-wide cache. The compute accelerator 330 can alsoconnect to a host processor and memory via a host interface 328 in asimilar manner as the graphics processor 320 of FIG. 3B.

Graphics Processing Engine

FIG. 4 is a block diagram of a graphics processing engine 410 of agraphics processor in accordance with some embodiments. In oneembodiment, the graphics processing engine (GPE) 410 is a version of theGPE 310 shown in FIG. 3A, and may also represent a graphics engine tile310A-310D of FIG. 3B. Elements of FIG. 4 having the same referencenumbers (or names) as the elements of any other figure herein canoperate or function in any manner similar to that described elsewhereherein, but are not limited to such. For example, the 3D pipeline 312and media pipeline 316 of FIG. 3A are illustrated. The media pipeline316 is optional in some embodiments of the GPE 410 and may not beexplicitly included within the GPE 410. For example and in at least oneembodiment, a separate media and/or image processor is coupled to theGPE 410.

In some embodiments, GPE 410 couples with or includes a command streamer403, which provides a command stream to the 3D pipeline 312 and/or mediapipelines 316. In some embodiments, command streamer 403 is coupled withmemory, which can be system memory, or one or more of internal cachememory and shared cache memory. In some embodiments, command streamer403 receives commands from the memory and sends the commands to 3Dpipeline 312 and/or media pipeline 316. The commands are directivesfetched from a ring buffer, which stores commands for the 3D pipeline312 and media pipeline 316. In one embodiment, the ring buffer canadditionally include batch command buffers storing batches of multiplecommands. The commands for the 3D pipeline 312 can also includereferences to data stored in memory, such as but not limited to vertexand geometry data for the 3D pipeline 312 and/or image data and memoryobjects for the media pipeline 316. The 3D pipeline 312 and mediapipeline 316 process the commands and data by performing operations vialogic within the respective pipelines or by dispatching one or moreexecution threads to a graphics core array 414. In one embodiment thegraphics core array 414 include one or more blocks of graphics cores(e.g., graphics core(s) 415A, graphics core(s) 415B), each blockincluding one or more graphics cores. Each graphics core includes a setof graphics execution resources that includes general-purpose andgraphics specific execution logic to perform graphics and computeoperations, as well as fixed function texture processing and/or machinelearning and artificial intelligence acceleration logic.

In various embodiments the 3D pipeline 312 can include fixed functionand programmable logic to process one or more shader programs, such asvertex shaders, geometry shaders, pixel shaders, fragment shaders,compute shaders, or other shader programs, by processing theinstructions and dispatching execution threads to the graphics corearray 414. The graphics core array 414 provides a unified block ofexecution resources for use in processing these shader programs.Multi-purpose execution logic (e.g., execution units) within thegraphics core(s) 415A-414B of the graphic core array 414 includessupport for various 3D API shader languages and can execute multiplesimultaneous execution threads associated with multiple shaders.

In some embodiments, the graphics core array 414 includes executionlogic to perform media functions, such as video and/or image processing.In one embodiment, the execution units include general-purpose logicthat is programmable to perform parallel general-purpose computationaloperations, in addition to graphics processing operations. Thegeneral-purpose logic can perform processing operations in parallel orin conjunction with general-purpose logic within the processor core(s)107 of FIG. 1 or core 202A-202N as in FIG. 2A.

Output data generated by threads executing on the graphics core array414 can output data to memory in a unified return buffer (URB) 418. TheURB 418 can store data for multiple threads. In some embodiments the URB418 may be used to send data between different threads executing on thegraphics core array 414. In some embodiments the URB 418 mayadditionally be used for synchronization between threads on the graphicscore array and fixed function logic within the shared function logic420.

In some embodiments, graphics core array 414 is scalable, such that thearray includes a variable number of graphics cores, each having avariable number of execution units based on the target power andperformance level of GPE 410. In one embodiment the execution resourcesare dynamically scalable, such that execution resources may be enabledor disabled as needed.

The graphics core array 414 couples with shared function logic 420 thatincludes multiple resources that are shared between the graphics coresin the graphics core array. The shared functions within the sharedfunction logic 420 are hardware logic units that provide specializedsupplemental functionality to the graphics core array 414. In variousembodiments, shared function logic 420 includes but is not limited tosampler 421, math 422, and inter-thread communication (ITC) 423 logic.Additionally, some embodiments implement one or more cache(s) 425 withinthe shared function logic 420.

A shared function is implemented at least in a case where the demand fora given specialized function is insufficient for inclusion within thegraphics core array 414. Instead a single instantiation of thatspecialized function is implemented as a stand-alone entity in theshared function logic 420 and shared among the execution resourceswithin the graphics core array 414. The precise set of functions thatare shared between the graphics core array 414 and included within thegraphics core array 414 varies across embodiments. In some embodiments,specific shared functions within the shared function logic 420 that areused extensively by the graphics core array 414 may be included withinshared function logic 416 within the graphics core array 414. In variousembodiments, the shared function logic 416 within the graphics corearray 414 can include some or all logic within the shared function logic420. In one embodiment, all logic elements within the shared functionlogic 420 may be duplicated within the shared function logic 416 of thegraphics core array 414. In one embodiment the shared function logic 420is excluded in favor of the shared function logic 416 within thegraphics core array 414.

Execution Units

FIGS. 5A-5B illustrate thread execution logic 500 including an array ofprocessing elements employed in a graphics processor core according toembodiments described herein. Elements of FIGS. 5A-5B having the samereference numbers (or names) as the elements of any other figure hereincan operate or function in any manner similar to that describedelsewhere herein, but are not limited to such. FIG. 5A-5B illustrates anoverview of thread execution logic 500, which may be representative ofhardware logic illustrated with each sub-core 221A-221F of FIG. 2B. FIG.5A is representative of an execution unit within a general-purposegraphics processor, while FIG. 5B is representative of an execution unitthat may be used within a compute accelerator.

As illustrated in FIG. 5A, in some embodiments thread execution logic500 includes a shader processor 502, a thread dispatcher 504,instruction cache 506, a scalable execution unit array including aplurality of execution units 508A-508N, a sampler 510, shared localmemory 511, a data cache 512, and a data port 514. In one embodiment thescalable execution unit array can dynamically scale by enabling ordisabling one or more execution units (e.g., any of execution units508A, 508B, 508C, 508D, through 508N-1 and 508N) based on thecomputational requirements of a workload. In one embodiment the includedcomponents are interconnected via an interconnect fabric that links toeach of the components. In some embodiments, thread execution logic 500includes one or more connections to memory, such as system memory orcache memory, through one or more of instruction cache 506, data port514, sampler 510, and execution units 508A-508N. In some embodiments,each execution unit (e.g. 508A) is a stand-alone programmablegeneral-purpose computational unit that is capable of executing multiplesimultaneous hardware threads while processing multiple data elements inparallel for each thread. In various embodiments, the array of executionunits 508A-508N is scalable to include any number individual executionunits.

In some embodiments, the execution units 508A-508N are primarily used toexecute shader programs. A shader processor 502 can process the variousshader programs and dispatch execution threads associated with theshader programs via a thread dispatcher 504. In one embodiment thethread dispatcher includes logic to arbitrate thread initiation requestsfrom the graphics and media pipelines and instantiate the requestedthreads on one or more execution unit in the execution units 508A-508N.For example, a geometry pipeline can dispatch vertex, tessellation, orgeometry shaders to the thread execution logic for processing. In someembodiments, thread dispatcher 504 can also process runtime threadspawning requests from the executing shader programs.

In some embodiments, the execution units 508A-508N support aninstruction set that includes native support for many standard 3Dgraphics shader instructions, such that shader programs from graphicslibraries (e.g., Direct 3D and OpenGL) are executed with a minimaltranslation. The execution units support vertex and geometry processing(e.g., vertex programs, geometry programs, vertex shaders), pixelprocessing (e.g., pixel shaders, fragment shaders) and general-purposeprocessing (e.g., compute and media shaders). Each of the executionunits 508A-508N is capable of multi-issue single instruction multipledata (SIMD) execution and multi-threaded operation enables an efficientexecution environment in the face of higher latency memory accesses.Each hardware thread within each execution unit has a dedicatedhigh-bandwidth register file and associated independent thread-state.Execution is multi-issue per clock to pipelines capable of integer,single and double precision floating point operations, SIMD branchcapability, logical operations, transcendental operations, and othermiscellaneous operations. While waiting for data from memory or one ofthe shared functions, dependency logic within the execution units508A-508N causes a waiting thread to sleep until the requested data hasbeen returned. While the waiting thread is sleeping, hardware resourcesmay be devoted to processing other threads. For example, during a delayassociated with a vertex shader operation, an execution unit can performoperations for a pixel shader, fragment shader, or another type ofshader program, including a different vertex shader. Various embodimentscan apply to use execution by use of Single Instruction Multiple Thread(SIMT) as an alternate to use of SIMD or in addition to use of SIMD.Reference to a SIMD core or operation can apply also to SIMT or apply toSIMD in combination with SIMT.

Each execution unit in execution units 508A-508N operates on arrays ofdata elements. The number of data elements is the “execution size,” orthe number of channels for the instruction. An execution channel is alogical unit of execution for data element access, masking, and flowcontrol within instructions. The number of channels may be independentof the number of physical Arithmetic Logic Units (ALUs) or FloatingPoint Units (FPUs) for a particular graphics processor. In someembodiments, execution units 508A-508N support integer andfloating-point data types.

The execution unit instruction set includes SIMD instructions. Thevarious data elements can be stored as a packed data type in a registerand the execution unit will process the various elements based on thedata size of the elements. For example, when operating on a 256-bit widevector, the 256 bits of the vector are stored in a register and theexecution unit operates on the vector as four separate 54-bit packeddata elements (Quad-Word (QW) size data elements), eight separate 32-bitpacked data elements (Double Word (DW) size data elements), sixteenseparate 16-bit packed data elements (Word (W) size data elements), orthirty-two separate 8-bit data elements (byte (B) size data elements).However, different vector widths and register sizes are possible.

In one embodiment one or more execution units can be combined into afused execution unit 509A-509N having thread control logic (507A-507N)that is common to the fused EUs. Multiple EUs can be fused into an EUgroup. Each EU in the fused EU group can be configured to execute aseparate SIMD hardware thread. The number of EUs in a fused EU group canvary according to embodiments. Additionally, various SIMD widths can beperformed per-EU, including but not limited to SIMD8, SIMD16, andSIMD32. Each fused graphics execution unit 509A-509N includes at leasttwo execution units. For example, fused execution unit 509A includes afirst EU 508A, second EU 508B, and thread control logic 507A that iscommon to the first EU 508A and the second EU 508B. The thread controllogic 507A controls threads executed on the fused graphics executionunit 509A, allowing each EU within the fused execution units 509A-509Nto execute using a common instruction pointer register.

One or more internal instruction caches (e.g., 506) are included in thethread execution logic 500 to cache thread instructions for theexecution units. In some embodiments, one or more data caches (e.g.,512) are included to cache thread data during thread execution. Threadsexecuting on the execution logic 500 can also store explicitly manageddata in the shared local memory 511. In some embodiments, a sampler 510is included to provide texture sampling for 3D operations and mediasampling for media operations. In some embodiments, sampler 510 includesspecialized texture or media sampling functionality to process textureor media data during the sampling process before providing the sampleddata to an execution unit.

During execution, the graphics and media pipelines send threadinitiation requests to thread execution logic 500 via thread spawningand dispatch logic. Once a group of geometric objects has been processedand rasterized into pixel data, pixel processor logic (e.g., pixelshader logic, fragment shader logic, etc.) within the shader processor502 is invoked to further compute output information and cause resultsto be written to output surfaces (e.g., color buffers, depth buffers,stencil buffers, etc.). In some embodiments, a pixel shader or fragmentshader calculates the values of the various vertex attributes that areto be interpolated across the rasterized object. In some embodiments,pixel processor logic within the shader processor 502 then executes anapplication programming interface (API)-supplied pixel or fragmentshader program. To execute the shader program, the shader processor 502dispatches threads to an execution unit (e.g., 508A) via threaddispatcher 504. In some embodiments, shader processor 502 uses texturesampling logic in the sampler 510 to access texture data in texture mapsstored in memory. Arithmetic operations on the texture data and theinput geometry data compute pixel color data for each geometricfragment, or discards one or more pixels from further processing.

In some embodiments, the data port 514 provides a memory accessmechanism for the thread execution logic 500 to output processed data tomemory for further processing on a graphics processor output pipeline.In some embodiments, the data port 514 includes or couples to one ormore cache memories (e.g., data cache 512) to cache data for memoryaccess via the data port.

In one embodiment, the execution logic 500 can also include a ray tracer505 that can provide ray tracing acceleration functionality. The raytracer 505 can support a ray tracing instruction set that includesinstructions/functions for ray generation. The ray tracing instructionset can be similar to or different from the ray-tracing instruction setsupported by the ray tracing cores 245 in FIG. 2C.

FIG. 5B illustrates exemplary internal details of an execution unit 508,according to embodiments. A graphics execution unit 508 can include aninstruction fetch unit 537, a general register file array (GRF) 524, anarchitectural register file array (ARF) 526, a thread arbiter 522, asend unit 530, a branch unit 532, a set of SIMD floating point units(FPUs) 534, and in one embodiment a set of dedicated integer SIMD ALUs535. The GRF 524 and ARF 526 includes the set of general register filesand architecture register files associated with each simultaneoushardware thread that may be active in the graphics execution unit 508.In one embodiment, per thread architectural state is maintained in theARF 526, while data used during thread execution is stored in the GRF524. The execution state of each thread, including the instructionpointers for each thread, can be held in thread-specific registers inthe ARF 526.

In one embodiment the graphics execution unit 508 has an architecturethat is a combination of Simultaneous Multi-Threading (SMT) andfine-grained Interleaved Multi-Threading (IMT). The architecture has amodular configuration that can be fine-tuned at design time based on atarget number of simultaneous threads and number of registers perexecution unit, where execution unit resources are divided across logicused to execute multiple simultaneous threads. The number of logicalthreads that may be executed by the graphics execution unit 508 is notlimited to the number of hardware threads, and multiple logical threadscan be assigned to each hardware thread.

In one embodiment, the graphics execution unit 508 can co-issue multipleinstructions, which may each be different instructions. The threadarbiter 522 of the graphics execution unit thread 508 can dispatch theinstructions to one of the send unit 530, branch unit 532, or SIMDFPU(s) 534 for execution. Each execution thread can access 128general-purpose registers within the GRF 524, where each register canstore 32 bytes, accessible as a SIMD 8-element vector of 32-bit dataelements. In one embodiment, each execution unit thread has access to 4Kbytes within the GRF 524, although embodiments are not so limited, andgreater or fewer register resources may be provided in otherembodiments. In one embodiment the graphics execution unit 508 ispartitioned into seven hardware threads that can independently performcomputational operations, although the number of threads per executionunit can also vary according to embodiments. For example, in oneembodiment up to 16 hardware threads are supported. In an embodiment inwhich seven threads may access 4 Kbytes, the GRF 524 can store a totalof 28 Kbytes. Where 16 threads may access 4 Kbytes, the GRF 524 canstore a total of 64 Kbytes. Flexible addressing modes can permitregisters to be addressed together to build effectively wider registersor to represent strided rectangular block data structures.

In one embodiment, memory operations, sampler operations, and otherlonger-latency system communications are dispatched via “send”instructions that are executed by the message passing send unit 530. Inone embodiment, branch instructions are dispatched to a dedicated branchunit 532 to facilitate SIMD divergence and eventual convergence.

In one embodiment the graphics execution unit 508 includes one or moreSIMD floating point units (FPU(s)) 534 to perform floating-pointoperations. In one embodiment, the FPU(s) 534 also support integercomputation. In one embodiment the FPU(s) 534 can SIMD execute up to Mnumber of 32-bit floating-point (or integer) operations, or SIMD executeup to 2M 16-bit integer or 16-bit floating-point operations. In oneembodiment, at least one of the FPU(s) provides extended math capabilityto support high-throughput transcendental math functions and doubleprecision 54-bit floating-point. In some embodiments, a set of 8-bitinteger SIMD ALUs 535 are also present, and may be specificallyoptimized to perform operations associated with machine learningcomputations.

In one embodiment, arrays of multiple instances of the graphicsexecution unit 508 can be instantiated in a graphics sub-core grouping(e.g., a sub-slice). For scalability, product architects can choose theexact number of execution units per sub-core grouping. In one embodimentthe execution unit 508 can execute instructions across a plurality ofexecution channels. In a further embodiment, each thread executed on thegraphics execution unit 508 is executed on a different channel.

FIG. 6 illustrates an additional execution unit 600, according to anembodiment. The execution unit 600 may be a compute-optimized executionunit for use in, for example, a compute engine tile 340A-340D as in FIG.3C, but is not limited as such. Variants of the execution unit 600 mayalso be used in a graphics engine tile 310A-310D as in FIG. 3B. In oneembodiment, the execution unit 600 includes a thread control unit 601, athread state unit 602, an instruction fetch/prefetch unit 603, and aninstruction decode unit 604. The execution unit 600 additionallyincludes a register file 606 that stores registers that can be assignedto hardware threads within the execution unit. The execution unit 600additionally includes a send unit 607 and a branch unit 608. In oneembodiment, the send unit 607 and branch unit 608 can operate similarlyas the send unit 530 and a branch unit 532 of the graphics executionunit 508 of FIG. 5B.

The execution unit 600 also includes a compute unit 610 that includesmultiple different types of functional units. In one embodiment thecompute unit 610 includes an ALU unit 611 that includes an array ofarithmetic logic units. The ALU unit 611 can be configured to perform64-bit, 32-bit, and 16-bit integer and floating point operations.Integer and floating point operations may be performed simultaneously.The compute unit 610 can also include a systolic array 612, and a mathunit 613. The systolic array 612 includes a W wide and D deep network ofdata processing units that can be used to perform vector or otherdata-parallel operations in a systolic manner In one embodiment thesystolic array 612 can be configured to perform matrix operations, suchas matrix dot product operations. In one embodiment the systolic array612 support 16-bit floating point operations, as well as 8-bit and 4-bitinteger operations. In one embodiment the systolic array 612 can beconfigured to accelerate machine learning operations. In suchembodiments, the systolic array 612 can be configured with support forthe bfloat 16-bit floating point format. In one embodiment, a math unit613 can be included to perform a specific subset of mathematicaloperations in an efficient and lower-power manner than then ALU unit611. The math unit 613 can include a variant of math logic that may befound in shared function logic of a graphics processing engine providedby other embodiments (e.g., math logic 422 of the shared function logic420 of FIG. 4). In one embodiment the math unit 613 can be configured toperform 32-bit and 64-bit floating point operations.

The thread control unit 601 includes logic to control the execution ofthreads within the execution unit. The thread control unit 601 caninclude thread arbitration logic to start, stop, and preempt executionof threads within the execution unit 600. The thread state unit 602 canbe used to store thread state for threads assigned to execute on theexecution unit 600. Storing the thread state within the execution unit600 enables the rapid pre-emption of threads when those threads becomeblocked or idle. The instruction fetch/prefetch unit 603 can fetchinstructions from an instruction cache of higher level execution logic(e.g., instruction cache 506 as in FIG. 5A). The instructionfetch/prefetch unit 603 can also issue prefetch requests forinstructions to be loaded into the instruction cache based on ananalysis of currently executing threads. The instruction decode unit 604can be used to decode instructions to be executed by the compute units.In one embodiment, the instruction decode unit 604 can be used as asecondary decoder to decode complex instructions into constituentmicro-operations.

The execution unit 600 additionally includes a register file 606 thatcan be used by hardware threads executing on the execution unit 600.Registers in the register file 606 can be divided across the logic usedto execute multiple simultaneous threads within the compute unit 610 ofthe execution unit 600. The number of logical threads that may beexecuted by the graphics execution unit 600 is not limited to the numberof hardware threads, and multiple logical threads can be assigned toeach hardware thread. The size of the register file 606 can vary acrossembodiments based on the number of supported hardware threads. In oneembodiment, register renaming may be used to dynamically allocateregisters to hardware threads.

FIG. 7 is a block diagram illustrating a graphics processor instructionformats 700 according to some embodiments. In one or more embodiment,the graphics processor execution units support an instruction set havinginstructions in multiple formats. The solid lined boxes illustrate thecomponents that are generally included in an execution unit instruction,while the dashed lines include components that are optional or that areonly included in a sub-set of the instructions. In some embodiments,instruction format 700 described and illustrated are macro-instructions,in that they are instructions supplied to the execution unit, as opposedto micro-operations resulting from instruction decode once theinstruction is processed.

In some embodiments, the graphics processor execution units nativelysupport instructions in a 128-bit instruction format 710. A 64-bitcompacted instruction format 730 is available for some instructionsbased on the selected instruction, instruction options, and number ofoperands. The native 128-bit instruction format 710 provides access toall instruction options, while some options and operations arerestricted in the 64-bit format 730. The native instructions availablein the 64-bit format 730 vary by embodiment. In some embodiments, theinstruction is compacted in part using a set of index values in an indexfield 713. The execution unit hardware references a set of compactiontables based on the index values and uses the compaction table outputsto reconstruct a native instruction in the 128-bit instruction format710. Other sizes and formats of instruction can be used.

For each format, instruction opcode 712 defines the operation that theexecution unit is to perform. The execution units execute eachinstruction in parallel across the multiple data elements of eachoperand. For example, in response to an add instruction the executionunit performs a simultaneous add operation across each color channelrepresenting a texture element or picture element. By default, theexecution unit performs each instruction across all data channels of theoperands. In some embodiments, instruction control field 714 enablescontrol over certain execution options, such as channels selection(e.g., predication) and data channel order (e.g., swizzle). Forinstructions in the 128-bit instruction format 710 an exec-size field716 limits the number of data channels that will be executed inparallel. In some embodiments, exec-size field 716 is not available foruse in the 64-bit compact instruction format 730.

Some execution unit instructions have up to three operands including twosource operands, src0 720, src1 722, and one destination 718. In someembodiments, the execution units support dual destination instructions,where one of the destinations is implied. Data manipulation instructionscan have a third source operand (e.g., SRC2 724), where the instructionopcode 712 determines the number of source operands. An instruction'slast source operand can be an immediate (e.g., hard-coded) value passedwith the instruction.

In some embodiments, the 128-bit instruction format 710 includes anaccess/address mode field 726, which specifies an address mode and/or anaccess mode for the instruction. In one embodiment the access mode isused to define a data access alignment for the instruction. Someembodiments support access modes including a 16-byte aligned access modeand a 1-byte aligned access mode, where the byte alignment of the accessmode determines the access alignment of the instruction operands. Forexample, when in a first mode, the instruction may use byte-alignedaddressing for source and destination operands and when in a secondmode, the instruction may use 16-byte-aligned addressing for all sourceand destination operands.

In one embodiment, the address mode portion of the access/address modefield 726 determines whether the instruction is to use direct orindirect addressing. When direct register addressing mode is used bitsin the instruction directly provide the register address of one or moreoperands. When indirect register addressing mode is used, the registeraddress of one or more operands may be computed based on an addressregister value and an address immediate field in the instruction.

In some embodiments instructions are grouped based on opcode 712bit-fields to simplify Opcode decode 740. For an 8-bit opcode, bits 4,5, and 6 allow the execution unit to determine the type of opcode. Theprecise opcode grouping shown is merely an example. In some embodiments,a move and logic opcode group 742 includes data movement and logicinstructions (e.g., move (mov), compare (cmp)). In some embodiments,move and logic group 742 shares the five most significant bits (MSB),where move (mov) instructions are in the form of 0000xxxxb and logicinstructions are in the form of 0001xxxxb. A flow control instructiongroup 744 (e.g., call, jump (jmp)) includes instructions in the form of0010xxxxb (e.g., 0x20). A miscellaneous instruction group 746 includes amix of instructions, including synchronization instructions (e.g., wait,send) in the form of 0011xxxxb (e.g., 0x30). A parallel math instructiongroup 748 includes component-wise arithmetic instructions (e.g., add,multiply (mul)) in the form of 0100xxxxb (e.g., 0x40). The parallel mathgroup 748 performs the arithmetic operations in parallel across datachannels. The vector math group 750 includes arithmetic instructions(e.g., dp4) in the form of 0101xxxxb (e.g., 0x50). The vector math groupperforms arithmetic such as dot product calculations on vector operands.The illustrated opcode decode 740, in one embodiment, can be used todetermine which portion of an execution unit will be used to execute adecoded instruction. For example, some instructions may be designated assystolic instructions that will be performed by a systolic array. Otherinstructions, such as ray-tracing instructions (not shown) can be routedto a ray-tracing core or ray-tracing logic within a slice or partitionof execution logic.

In some embodiments, the 128-bit instruction format 710 includes anaccess/address mode field 726, which specifies an address mode and/or anaccess mode for the instruction. In one embodiment the access mode isused to define a data access alignment for the instruction. Someembodiments support access modes including a 16-byte aligned access modeand a 1-byte aligned access mode, where the byte alignment of the accessmode determines the access alignment of the instruction operands. Forexample, when in a first mode, the instruction may use byte-alignedaddressing for source and destination operands and when in a secondmode, the instruction may use 16-byte-aligned addressing for all sourceand destination operands.

Graphics Pipeline

FIG. 8 is a block diagram of another embodiment of a graphics processor800. Elements of FIG. 8 having the same reference numbers (or names) asthe elements of any other figure herein can operate or function in anymanner similar to that described elsewhere herein, but are not limitedto such.

In some embodiments, graphics processor 800 includes a geometry pipeline820, a media pipeline 830, a display engine 840, thread execution logic850, and a render output pipeline 870. In some embodiments, graphicsprocessor 800 is a graphics processor within a multi-core processingsystem that includes one or more general purpose processing cores. Thegraphics processor is controlled by register writes to one or morecontrol registers (not shown) or via commands issued to graphicsprocessor 800 via a ring interconnect 802. In some embodiments, ringinterconnect 802 couples graphics processor 800 to other processingcomponents, such as other graphics processors or general-purposeprocessors. Commands from ring interconnect 802 are interpreted by acommand streamer 803, which supplies instructions to individualcomponents of the geometry pipeline 820 or the media pipeline 830.

In some embodiments, command streamer 803 directs the operation of avertex fetcher 805 that reads vertex data from memory and executesvertex-processing commands provided by command streamer 803. In someembodiments, vertex fetcher 805 provides vertex data to a vertex shader807, which performs coordinate space transformation and lightingoperations to each vertex. In some embodiments, vertex fetcher 805 andvertex shader 807 execute vertex-processing instructions by dispatchingexecution threads to execution units 852A-852B via a thread dispatcher831.

In some embodiments, execution units 852A-852B are an array of vectorprocessors having an instruction set for performing graphics and mediaoperations. In some embodiments, execution units 852A-852B have anattached L1 cache 851 that is specific for each array or shared betweenthe arrays. The cache can be configured as a data cache, an instructioncache, or a single cache that is partitioned to contain data andinstructions in different partitions.

In some embodiments, geometry pipeline 820 includes tessellationcomponents to perform hardware-accelerated tessellation of 3D objects.In some embodiments, a programmable hull shader 811 configures thetessellation operations. A programmable domain shader 817 providesback-end evaluation of tessellation output. A tessellator 813 operatesat the direction of hull shader 811 and contains special purpose logicto generate a set of detailed geometric objects based on a coarsegeometric model that is provided as input to geometry pipeline 820. Insome embodiments, if tessellation is not used, tessellation components(e.g., hull shader 811, tessellator 813, and domain shader 817) can bebypassed. The tessellation components can operate based on data receivedfrom the vertex shader 807.

In some embodiments, complete geometric objects can be processed by ageometry shader 819 via one or more threads dispatched to executionunits 852A-852B, or can proceed directly to the clipper 829. In someembodiments, the geometry shader operates on entire geometric objects,rather than vertices or patches of vertices as in previous stages of thegraphics pipeline. If the tessellation is disabled, the geometry shader819 receives input from the vertex shader 807. In some embodiments,geometry shader 819 is programmable by a geometry shader program toperform geometry tessellation if the tessellation units are disabled.

Before rasterization, a clipper 829 can process vertex data. The clipper829 may be a fixed function clipper or a programmable clipper havingclipping and geometry shader functions. In some embodiments, arasterizer and depth test component 873 in the render output pipeline870 dispatches pixel shaders to convert the geometric objects into perpixel representations. In some embodiments, pixel shader logic isincluded in thread execution logic 850. In some embodiments, anapplication can bypass the rasterizer and depth test component 873 andaccess un-rasterized vertex data via a stream out unit 823.

The graphics processor 800 has an interconnect bus, interconnect fabric,or some other interconnect mechanism that allows data and messagepassing amongst the major components of the processor. In someembodiments, execution units 852A-852B and associated logic units (e.g.,L1 cache 851, sampler 854, texture cache 858, etc.) interconnect via adata port 856 to perform memory access and communicate with renderoutput pipeline components of the processor. In some embodiments,sampler 854, caches 851, 858 and execution units 852A-852B each haveseparate memory access paths. In one embodiment the texture cache 858can also be configured as a sampler cache.

In some embodiments, render output pipeline 870 contains a rasterizerand depth test component 873 that converts vertex-based objects into anassociated pixel-based representation. In some embodiments, therasterizer logic includes a windower/masker unit to perform fixedfunction triangle and line rasterization. An associated render cache 878and depth cache 879 are also available in some embodiments. A pixeloperations component 877 performs pixel-based operations on the data,though in some instances, pixel operations associated with 2D operations(e.g. bit block image transfers with blending) are performed by the 2Dengine 841, or substituted at display time by the display controller 843using overlay display planes. In some embodiments, a shared L3 cache 875is available to all graphics components, allowing the sharing of datawithout the use of main system memory.

In some embodiments, graphics processor media pipeline 830 includes amedia engine 837 and a video front-end 834. In some embodiments, videofront-end 834 receives pipeline commands from the command streamer 803.In some embodiments, media pipeline 830 includes a separate commandstreamer. In some embodiments, video front-end 834 processes mediacommands before sending the command to the media engine 837. In someembodiments, media engine 837 includes thread spawning functionality tospawn threads for dispatch to thread execution logic 850 via threaddispatcher 831.

In some embodiments, graphics processor 800 includes a display engine840. In some embodiments, display engine 840 is external to processor800 and couples with the graphics processor via the ring interconnect802, or some other interconnect bus or fabric. In some embodiments,display engine 840 includes a 2D engine 841 and a display controller843. In some embodiments, display engine 840 contains special purposelogic capable of operating independently of the 3D pipeline. In someembodiments, display controller 843 couples with a display device (notshown), which may be a system integrated display device, as in a laptopcomputer, or an external display device attached via a display deviceconnector.

In some embodiments, the geometry pipeline 820 and media pipeline 830are configurable to perform operations based on multiple graphics andmedia programming interfaces and are not specific to any one applicationprogramming interface (API). In some embodiments, driver software forthe graphics processor translates API calls that are specific to aparticular graphics or media library into commands that can be processedby the graphics processor. In some embodiments, support is provided forthe Open Graphics Library (OpenGL), Open Computing Language (OpenCL),and/or Vulkan graphics and compute API, all from the Khronos Group. Insome embodiments, support may also be provided for the Direct3D libraryfrom the Microsoft Corporation. In some embodiments, a combination ofthese libraries may be supported. Support may also be provided for theOpen Source Computer Vision Library (OpenCV). A future API with acompatible 3D pipeline would also be supported if a mapping can be madefrom the pipeline of the future API to the pipeline of the graphicsprocessor.

Graphics Pipeline Programming

FIG. 9A is a block diagram illustrating a graphics processor commandformat 900 according to some embodiments. FIG. 9B is a block diagramillustrating a graphics processor command sequence 910 according to anembodiment. The solid lined boxes in FIG. 9A illustrate the componentsthat are generally included in a graphics command while the dashed linesinclude components that are optional or that are only included in asub-set of the graphics commands. The exemplary graphics processorcommand format 900 of FIG. 9A includes data fields to identify a client902, a command operation code (opcode) 904, and data 906 for the commandA sub-opcode 905 and a command size 908 are also included in somecommands.

In some embodiments, client 902 specifies the client unit of thegraphics device that processes the command data. In some embodiments, agraphics processor command parser examines the client field of eachcommand to condition the further processing of the command and route thecommand data to the appropriate client unit. In some embodiments, thegraphics processor client units include a memory interface unit, arender unit, a 2D unit, a 3D unit, and a media unit. Each client unithas a corresponding processing pipeline that processes the commands Oncethe command is received by the client unit, the client unit reads theopcode 904 and, if present, sub-opcode 905 to determine the operation toperform. The client unit performs the command using information in datafield 906. For some commands an explicit command size 908 is expected tospecify the size of the command In some embodiments, the command parserautomatically determines the size of at least some of the commands basedon the command opcode. In some embodiments commands are aligned viamultiples of a double word.

The flow diagram in FIG. 9B illustrates an exemplary graphics processorcommand sequence 910. In some embodiments, software or firmware of adata processing system that features an embodiment of a graphicsprocessor uses a version of the command sequence shown to set up,execute, and terminate a set of graphics operations. A sample commandsequence is shown and described for purposes of example only asembodiments are not limited to these specific commands or to thiscommand sequence. Moreover, the commands may be issued as batch ofcommands in a command sequence, such that the graphics processor willprocess the sequence of commands in at least partially concurrence.

In some embodiments, the graphics processor command sequence 910 maybegin with a pipeline flush command 912 to cause any active graphicspipeline to complete the currently pending commands for the pipeline. Insome embodiments, the 3D pipeline 922 and the media pipeline 924 do notoperate concurrently. The pipeline flush is performed to cause theactive graphics pipeline to complete any pending commands In response toa pipeline flush, the command parser for the graphics processor willpause command processing until the active drawing engines completepending operations and the relevant read caches are invalidated.Optionally, any data in the render cache that is marked ‘dirty’ can beflushed to memory. In some embodiments, pipeline flush command 912 canbe used for pipeline synchronization or before placing the graphicsprocessor into a low power state.

In some embodiments, a pipeline select command 913 is used when acommand sequence requires the graphics processor to explicitly switchbetween pipelines. In some embodiments, a pipeline select command 913 isrequired only once within an execution context before issuing pipelinecommands unless the context is to issue commands for both pipelines. Insome embodiments, a pipeline flush command 912 is required immediatelybefore a pipeline switch via the pipeline select command 913.

In some embodiments, a pipeline control command 914 configures agraphics pipeline for operation and is used to program the 3D pipeline922 and the media pipeline 924. In some embodiments, pipeline controlcommand 914 configures the pipeline state for the active pipeline. Inone embodiment, the pipeline control command 914 is used for pipelinesynchronization and to clear data from one or more cache memories withinthe active pipeline before processing a batch of commands.

In some embodiments, return buffer state commands 916 are used toconfigure a set of return buffers for the respective pipelines to writedata. Some pipeline operations require the allocation, selection, orconfiguration of one or more return buffers into which the operationswrite intermediate data during processing. In some embodiments, thegraphics processor also uses one or more return buffers to store outputdata and to perform cross thread communication. In some embodiments, thereturn buffer state 916 includes selecting the size and number of returnbuffers to use for a set of pipeline operations.

The remaining commands in the command sequence differ based on theactive pipeline for operations. Based on a pipeline determination 920,the command sequence is tailored to the 3D pipeline 922 beginning withthe 3D pipeline state 930 or the media pipeline 924 beginning at themedia pipeline state 940.

The commands to configure the 3D pipeline state 930 include 3D statesetting commands for vertex buffer state, vertex element state, constantcolor state, depth buffer state, and other state variables that are tobe configured before 3D primitive commands are processed. The values ofthese commands are determined at least in part based on the particular3D API in use. In some embodiments, 3D pipeline state 930 commands arealso able to selectively disable or bypass certain pipeline elements ifthose elements will not be used.

In some embodiments, 3D primitive 932 command is used to submit 3Dprimitives to be processed by the 3D pipeline. Commands and associatedparameters that are passed to the graphics processor via the 3Dprimitive 932 command are forwarded to the vertex fetch function in thegraphics pipeline. The vertex fetch function uses the 3D primitive 932command data to generate vertex data structures. The vertex datastructures are stored in one or more return buffers. In someembodiments, 3D primitive 932 command is used to perform vertexoperations on 3D primitives via vertex shaders. To process vertexshaders, 3D pipeline 922 dispatches shader execution threads to graphicsprocessor execution units.

In some embodiments, 3D pipeline 922 is triggered via an execute 934command or event. In some embodiments, a register write triggers commandexecution. In some embodiments execution is triggered via a ‘go’ or‘kick’ command in the command sequence. In one embodiment, commandexecution is triggered using a pipeline synchronization command to flushthe command sequence through the graphics pipeline. The 3D pipeline willperform geometry processing for the 3D primitives. Once operations arecomplete, the resulting geometric objects are rasterized and the pixelengine colors the resulting pixels. Additional commands to control pixelshading and pixel back end operations may also be included for thoseoperations.

In some embodiments, the graphics processor command sequence 910 followsthe media pipeline 924 path when performing media operations. Ingeneral, the specific use and manner of programming for the mediapipeline 924 depends on the media or compute operations to be performed.Specific media decode operations may be offloaded to the media pipelineduring media decode. In some embodiments, the media pipeline can also bebypassed, and media decode can be performed in whole or in part usingresources provided by one or more general purpose processing cores. Inone embodiment, the media pipeline also includes elements forgeneral-purpose graphics processor unit (GPGPU) operations, where thegraphics processor is used to perform SIMD vector operations usingcomputational shader programs that are not explicitly related to therendering of graphics primitives.

In some embodiments, media pipeline 924 is configured in a similarmanner as the 3D pipeline 922. A set of commands to configure the mediapipeline state 940 are dispatched or placed into a command queue beforethe media object commands 942. In some embodiments, commands for themedia pipeline state 940 include data to configure the media pipelineelements that will be used to process the media objects. This includesdata to configure the video decode and video encode logic within themedia pipeline, such as encode or decode format. In some embodiments,commands for the media pipeline state 940 also support the use of one ormore pointers to “indirect” state elements that contain a batch of statesettings.

In some embodiments, media object commands 942 supply pointers to mediaobjects for processing by the media pipeline. The media objects includememory buffers containing video data to be processed. In someembodiments, all media pipeline states must be valid before issuing amedia object command 942. Once the pipeline state is configured andmedia object commands 942 are queued, the media pipeline 924 istriggered via an execute command 944 or an equivalent execute event(e.g., register write). Output from media pipeline 924 may then be postprocessed by operations provided by the 3D pipeline 922 or the mediapipeline 924. In some embodiments, GPGPU operations are configured andexecuted in a similar manner as media operations.

Graphics Software Architecture

FIG. 10 illustrates exemplary graphics software architecture for a dataprocessing system 1000 according to some embodiments. In someembodiments, software architecture includes a 3D graphics application1010, an operating system 1020, and at least one processor 1030. In someembodiments, processor 1030 includes a graphics processor 1032 and oneor more general-purpose processor core(s) 1034. The graphics application1010 and operating system 1020 each execute in the system memory 1050 ofthe data processing system.

In some embodiments, 3D graphics application 1010 contains one or moreshader programs including shader instructions 1012. The shader languageinstructions may be in a high-level shader language, such as theHigh-Level Shader Language (HLSL) or the OpenGL Shader Language (GLSL).The application also includes executable instructions 1014 in a machinelanguage suitable for execution by the general-purpose processor core1034. The application also includes graphics objects 1016 defined byvertex data.

In some embodiments, operating system 1020 is a Microsoft® Windows®operating system from the Microsoft Corporation, a proprietary UNIX-likeoperating system, or an open source UNIX-like operating system using avariant of the Linux kernel. The operating system 1020 can support agraphics API 1022 such as the Direct3D API, the OpenGL API, or theVulkan API. When the Direct3D API is in use, the operating system 1020uses a front-end shader compiler 1024 to compile any shader instructions1012 in HLSL into a lower-level shader language. The compilation may bea just-in-time (JIT) compilation or the application can perform shaderpre-compilation. In some embodiments, high-level shaders are compiledinto low-level shaders during the compilation of the 3D graphicsapplication 1010. In some embodiments, the shader instructions 1012 areprovided in an intermediate form, such as a version of the StandardPortable Intermediate Representation (SPIR) used by the Vulkan API.

In some embodiments, user mode graphics driver 1026 contains a back-endshader compiler 1027 to convert the shader instructions 1012 into ahardware specific representation. When the OpenGL API is in use, shaderinstructions 1012 in the GLSL high-level language are passed to a usermode graphics driver 1026 for compilation. In some embodiments, usermode graphics driver 1026 uses operating system kernel mode functions1028 to communicate with a kernel mode graphics driver 1029. In someembodiments, kernel mode graphics driver 1029 communicates with graphicsprocessor 1032 to dispatch commands and instructions.

IP Core Implementations

One or more aspects of at least one embodiment may be implemented byrepresentative code stored on a machine-readable medium which representsand/or defines logic within an integrated circuit such as a processor.For example, the machine-readable medium may include instructions whichrepresent various logic within the processor. When read by a machine,the instructions may cause the machine to fabricate the logic to performthe techniques described herein. Such representations, known as “IPcores,” are reusable units of logic for an integrated circuit that maybe stored on a tangible, machine-readable medium as a hardware modelthat describes the structure of the integrated circuit. The hardwaremodel may be supplied to various customers or manufacturing facilities,which load the hardware model on fabrication machines that manufacturethe integrated circuit. The integrated circuit may be fabricated suchthat the circuit performs operations described in association with anyof the embodiments described herein.

FIG. 11A is a block diagram illustrating an IP core development system1100 that may be used to manufacture an integrated circuit to performoperations according to an embodiment. The IP core development system1100 may be used to generate modular, reusable designs that can beincorporated into a larger design or used to construct an entireintegrated circuit (e.g., an SOC integrated circuit). A design facility1130 can generate a software simulation 1110 of an IP core design in ahigh-level programming language (e.g., C/C++). The software simulation1110 can be used to design, test, and verify the behavior of the IP coreusing a simulation model 1112. The simulation model 1112 may includefunctional, behavioral, and/or timing simulations. A register transferlevel (RTL) design 1115 can then be created or synthesized from thesimulation model 1112. The RTL design 1115 is an abstraction of thebehavior of the integrated circuit that models the flow of digitalsignals between hardware registers, including the associated logicperformed using the modeled digital signals. In addition to an RTLdesign 1115, lower-level designs at the logic level or transistor levelmay also be created, designed, or synthesized. Thus, the particulardetails of the initial design and simulation may vary.

The RTL design 1115 or equivalent may be further synthesized by thedesign facility into a hardware model 1120, which may be in a hardwaredescription language (HDL), or some other representation of physicaldesign data. The HDL may be further simulated or tested to verify the IPcore design. The IP core design can be stored for delivery to a 3^(rd)party fabrication facility 1165 using non-volatile memory 1140 (e.g.,hard disk, flash memory, or any non-volatile storage medium).Alternatively, the IP core design may be transmitted (e.g., via theInternet) over a wired connection 1150 or wireless connection 1160. Thefabrication facility 1165 may then fabricate an integrated circuit thatis based at least in part on the IP core design. The fabricatedintegrated circuit can be configured to perform operations in accordancewith at least one embodiment described herein.

FIG. 11B illustrates a cross-section side view of an integrated circuitpackage assembly 1170, according to some embodiments described herein.The integrated circuit package assembly 1170 illustrates animplementation of one or more processor or accelerator devices asdescribed herein. The package assembly 1170 includes multiple units ofhardware logic 1172, 1174 connected to a substrate 1180. The logic 1172,1174 may be implemented at least partly in configurable logic orfixed-functionality logic hardware and can include one or more portionsof any of the processor core(s), graphics processor(s), or otheraccelerator devices described herein. Each unit of logic 1172, 1174 canbe implemented within a semiconductor die and coupled with the substrate1180 via an interconnect structure 1173. The interconnect structure 1173may be configured to route electrical signals between the logic 1172,1174 and the substrate 1180, and can include interconnects such as, butnot limited to bumps or pillars. In some embodiments, the interconnectstructure 1173 may be configured to route electrical signals such as,for example, input/output (I/O) signals and/or power or ground signalsassociated with the operation of the logic 1172, 1174. In someembodiments, the substrate 1180 is an epoxy-based laminate substrate.The package substrate 1180 may include other suitable types ofsubstrates in other embodiments. The package assembly 1170 can beconnected to other electrical devices via a package interconnect 1183.The package interconnect 1183 may be coupled to a surface of thesubstrate 1180 to route electrical signals to other electrical devices,such as a motherboard, other chipset, or multi-chip module.

In some embodiments, the units of logic 1172, 1174 are electricallycoupled with a bridge 1182 that is configured to route electricalsignals between the logic 1172, 1174. The bridge 1182 may be a denseinterconnect structure that provides a route for electrical signals. Thebridge 1182 may include a bridge substrate composed of glass or asuitable semiconductor material. Electrical routing features can beformed on the bridge substrate to provide a chip-to-chip connectionbetween the logic 1172, 1174.

Although two units of logic 1172, 1174 and a bridge 1182 areillustrated, embodiments described herein may include more or fewerlogic units on one or more dies. The one or more dies may be connectedby zero or more bridges, as the bridge 1182 may be excluded when thelogic is included on a single die. Alternatively, multiple dies or unitsof logic can be connected by one or more bridges. Additionally, multiplelogic units, dies, and bridges can be connected together in otherpossible configurations, including three-dimensional configurations.

FIG. 11C illustrates a package assembly 1190 that includes multipleunits of hardware logic chiplets connected to a substrate 1180 (e.g.,base die). A graphics processing unit, parallel processor, and/orcompute accelerator as described herein can be composed from diversesilicon chiplets that are separately manufactured. In this context, achiplet is an at least partially packaged integrated circuit thatincludes distinct units of logic that can be assembled with otherchiplets into a larger package. A diverse set of chiplets with differentIP core logic can be assembled into a single device. Additionally thechiplets can be integrated into a base die or base chiplet using activeinterposer technology. The concepts described herein enable theinterconnection and communication between the different forms of IPwithin the GPU. IP cores can be manufactured using different processtechnologies and composed during manufacturing, which avoids thecomplexity of converging multiple IPs, especially on a large SoC withseveral flavors IPs, to the same manufacturing process. Enabling the useof multiple process technologies improves the time to market andprovides a cost-effective way to create multiple product SKUs.Additionally, the disaggregated IPs are more amenable to being powergated independently, components that are not in use on a given workloadcan be powered off, reducing overall power consumption.

The hardware logic chiplets can include special purpose hardware logicchiplets 1172, logic or I/O chiplets 1174, and/or memory chiplets 1175.The hardware logic chiplets 1172 and logic or I/O chiplets 1174 may beimplemented at least partly in configurable logic or fixed-functionalitylogic hardware and can include one or more portions of any of theprocessor core(s), graphics processor(s), parallel processors, or otheraccelerator devices described herein. The memory chiplets 1175 can beDRAM (e.g., GDDR, HBM) memory or cache (SRAM) memory.

Each chiplet can be fabricated as separate semiconductor die and coupledwith the substrate 1180 via an interconnect structure 1173. Theinterconnect structure 1173 may be configured to route electricalsignals between the various chiplets and logic within the substrate1180. The interconnect structure 1173 can include interconnects such as,but not limited to bumps or pillars. In some embodiments, theinterconnect structure 1173 may be configured to route electricalsignals such as, for example, input/output (I/O) signals and/or power orground signals associated with the operation of the logic, I/O andmemory chiplets.

In some embodiments, the substrate 1180 is an epoxy-based laminatesubstrate. The substrate 1180 may include other suitable types ofsubstrates in other embodiments. The package assembly 1190 can beconnected to other electrical devices via a package interconnect 1183.The package interconnect 1183 may be coupled to a surface of thesubstrate 1180 to route electrical signals to other electrical devices,such as a motherboard, other chipset, or multi-chip module.

In some embodiments, a logic or I/O chiplet 1174 and a memory chiplet1175 can be electrically coupled via a bridge 1187 that is configured toroute electrical signals between the logic or I/O chiplet 1174 and amemory chiplet 1175. The bridge 1187 may be a dense interconnectstructure that provides a route for electrical signals. The bridge 1187may include a bridge substrate composed of glass or a suitablesemiconductor material. Electrical routing features can be formed on thebridge substrate to provide a chip-to-chip connection between the logicor I/O chiplet 1174 and a memory chiplet 1175. The bridge 1187 may alsobe referred to as a silicon bridge or an interconnect bridge. Forexample, the bridge 1187, in some embodiments, is an Embedded Multi-dieInterconnect Bridge (EMIB). In some embodiments, the bridge 1187 maysimply be a direct connection from one chiplet to another chiplet.

The substrate 1180 can include hardware components for I/O 1191, cachememory 1192, and other hardware logic 1193. A fabric 1185 can beembedded in the substrate 1180 to enable communication between thevarious logic chiplets and the logic 1191, 1193 within the substrate1180. In one embodiment, the I/O 1191, fabric 1185, cache, bridge, andother hardware logic 1193 can be integrated into a base die that islayered on top of the substrate 1180.

In various embodiments a package assembly 1190 can include fewer orgreater number of components and chiplets that are interconnected by afabric 1185 or one or more bridges 1187. The chiplets within the packageassembly 1190 may be arranged in a 3D or 2.5D arrangement. In general,bridge structures 1187 may be used to facilitate a point to pointinterconnect between, for example, logic or I/O chiplets and memorychiplets. The fabric 1185 can be used to interconnect the various logicand/or I/O chiplets (e.g., chiplets 1172, 1174, 1191, 1193). with otherlogic and/or I/O chiplets. In one embodiment, the cache memory 1192within the substrate can act as a global cache for the package assembly1190, part of a distributed global cache, or as a dedicated cache forthe fabric 1185.

FIG. 11D illustrates a package assembly 1194 including interchangeablechiplets 1195, according to an embodiment. The interchangeable chiplets1195 can be assembled into standardized slots on one or more basechiplets 1196, 1198. The base chiplets 1196, 1198 can be coupled via abridge interconnect 1197, which can be similar to the other bridgeinterconnects described herein and may be, for example, an EMIB. Memorychiplets can also be connected to logic or I/O chiplets via a bridgeinterconnect. I/O and logic chiplets can communicate via an interconnectfabric. The base chiplets can each support one or more slots in astandardized format for one of logic or I/O or memory/cache.

In one embodiment, SRAM and power delivery circuits can be fabricatedinto one or more of the base chiplets 1196, 1198, which can befabricated using a different process technology relative to theinterchangeable chiplets 1195 that are stacked on top of the basechiplets. For example, the base chiplets 1196, 1198 can be fabricatedusing a larger process technology, while the interchangeable chipletscan be manufactured using a smaller process technology. One or more ofthe interchangeable chiplets 1195 may be memory (e.g., DRAM) chiplets.Different memory densities can be selected for the package assembly 1194based on the power, and/or performance targeted for the product thatuses the package assembly 1194. Additionally, logic chiplets with adifferent number of type of functional units can be selected at time ofassembly based on the power, and/or performance targeted for theproduct. Additionally, chiplets containing IP logic cores of differingtypes can be inserted into the interchangeable chiplet slots, enablinghybrid processor designs that can mix and match different technology IPblocks.

Exemplary System on a Chip Integrated Circuit

FIGS. 12 and 13A-13B illustrate exemplary integrated circuits andassociated graphics processors that may be fabricated using one or moreIP cores, according to various embodiments described herein. In additionto what is illustrated, other logic and circuits may be included,including additional graphics processors/cores, peripheral interfacecontrollers, or general-purpose processor cores.

FIG. 12 is a block diagram illustrating an exemplary system on a chipintegrated circuit 1200 that may be fabricated using one or more IPcores, according to an embodiment. Exemplary integrated circuit 1200includes one or more application processor(s) 1205 (e.g., CPUs), atleast one graphics processor 1210, and may additionally include an imageprocessor 1215 and/or a video processor 1220, any of which may be amodular IP core from the same or multiple different design facilities.Integrated circuit 1200 includes peripheral or bus logic including a USBcontroller 1225, UART controller 1230, an SPI/SDIO controller 1235, andan I²S/I²C controller 1240. Additionally, the integrated circuit caninclude a display device 1245 coupled to one or more of ahigh-definition multimedia interface (HDMI) controller 1250 and a mobileindustry processor interface (MIPI) display interface 1255. Storage maybe provided by a flash memory subsystem 1260 including flash memory anda flash memory controller. Memory interface may be provided via a memorycontroller 1265 for access to SDRAM or SRAM memory devices. Someintegrated circuits additionally include an embedded security engine1270.

FIGS. 13A-13B are block diagrams illustrating exemplary graphicsprocessors for use within an SoC, according to embodiments describedherein. FIG. 13A illustrates an exemplary graphics processor 1310 of asystem on a chip integrated circuit that may be fabricated using one ormore IP cores, according to an embodiment. FIG. 13B illustrates anadditional exemplary graphics processor 1340 of a system on a chipintegrated circuit that may be fabricated using one or more IP cores,according to an embodiment. Graphics processor 1310 of FIG. 13A is anexample of a low power graphics processor core. Graphics processor 1340of FIG. 13B is an example of a higher performance graphics processorcore. Each of the graphics processors 1310, 1340 can be variants of thegraphics processor 1210 of FIG. 12.

As shown in FIG. 13A, graphics processor 1310 includes a vertexprocessor 1305 and one or more fragment processor(s) 1315A-1315N (e.g.,1315A, 1315B, 1315C, 1315D, through 1315N-1, and 1315N). Graphicsprocessor 1310 can execute different shader programs via separate logic,such that the vertex processor 1305 is optimized to execute operationsfor vertex shader programs, while the one or more fragment processor(s)1315A-1315N execute fragment (e.g., pixel) shading operations forfragment or pixel shader programs. The vertex processor 1305 performsthe vertex processing stage of the 3D graphics pipeline and generatesprimitives and vertex data. The fragment processor(s) 1315A-1315N usethe primitive and vertex data generated by the vertex processor 1305 toproduce a framebuffer that is displayed on a display device. In oneembodiment, the fragment processor(s) 1315A-1315N are optimized toexecute fragment shader programs as provided for in the OpenGL API,which may be used to perform similar operations as a pixel shaderprogram as provided for in the Direct 3D API.

Graphics processor 1310 additionally includes one or more memorymanagement units (MMUs) 1320A-1320B, cache(s) 1325A-1325B, and circuitinterconnect(s) 1330A-1330B. The one or more MMU(s) 1320A-1320B providefor virtual to physical address mapping for the graphics processor 1310,including for the vertex processor 1305 and/or fragment processor(s)1315A-1315N, which may reference vertex or image/texture data stored inmemory, in addition to vertex or image/texture data stored in the one ormore cache(s) 1325A-1325B. In one embodiment, the one or more MMU(s)1320A-1320B may be synchronized with other MMUs within the system,including one or more MMUs associated with the one or more applicationprocessor(s) 1205, image processor 1215, and/or video processor 1220 ofFIG. 12, such that each processor 1205-1220 can participate in a sharedor unified virtual memory system. The one or more circuitinterconnect(s) 1330A-1330B enable graphics processor 1310 to interfacewith other IP cores within the SoC, either via an internal bus of theSoC or via a direct connection, according to embodiments.

As shown FIG. 13B, graphics processor 1340 includes the one or moreMMU(s) 1320A-1320B, caches 1325A-1325B, and circuit interconnects1330A-1330B of the graphics processor 1310 of FIG. 13A. Graphicsprocessor 1340 includes one or more shader core(s) 1355A-1355N (e.g.,1455A, 1355B, 1355C, 1355D, 1355E, 1355F, through 1355N-1, and 1355N),which provides for a unified shader core architecture in which a singlecore or type or core can execute all types of programmable shader code,including shader program code to implement vertex shaders, fragmentshaders, and/or compute shaders. The exact number of shader corespresent can vary among embodiments and implementations. Additionally,graphics processor 1340 includes an inter-core task manager 1345, whichacts as a thread dispatcher to dispatch execution threads to one or moreshader cores 1355A-1355N and a tiling unit 1358 to accelerate tilingoperations for tile-based rendering, in which rendering operations for ascene are subdivided in image space, for example to exploit localspatial coherence within a scene or to optimize use of internal caches.

FIG. 14 illustrates a data processing system, according to embodimentsdescribed herein. Referring to FIG. 14, in some examples a dataprocessing system 1400 may be implemented as a heterogeneous processingsystem having a central processing unit (CPU) complex 1410, a unifiedmemory 1430, and a general-purpose graphics processing unit (GPGPU)1440. The CPU complex 1410 comprises one or more processors 1412 whichexecutes an operating system 1414. One or more gaming and/or mediaapplications 1416 may execute on the environment provided by theoperating system 1414 which executes on processor 1412. CPU complex 1410may further comprise a graphics device drive 1420 which executes adispatcher 1424. The processor 1412 can be implemented as any of theprocessors as described herein.

The GPGPU 1440 includes multiple compute blocks 1444A-1444N, whichinclude one or more instances of execution logic described herein. TheGPGPU 1440 also includes a set of registers 1445, cache memory 1447, anda power and performance module 1446 that can be used as shared resourcesfor the compute blocks 1444A-1444N. In one embodiment the registers 1445include directly and indirectly accessible registers, where theindirectly accessible registers may be optimized for use in matrixcompute operations. The power and performance module 1446 can beconfigured to adjust power delivery and clock frequencies for thecompute blocks 1444A-1444N to power gate idle components within thecompute blocks 1444A-1444N under heavy workloads. The GPGPU 1440includes GPGPU local memory 1448, which are physical memory modules thatshare a graphics card or multi-chip module with the GPGPU 1440.

The unified memory 1430 represents a unified address space that may beaccessed by the processor 1412 and the GPGPU 1440. The unified memoryincludes system memory 1432 as well as GPGPU memory 1438. In someembodiments the GPGPU memory 1438 includes GPGPU local memory 1434within the GPGPU 1440 and can also include some or all of system memory1432. For example, compiled code 1434B stored in system memory 1412 canalso be mapped into GPGPU memory 1438 for access by the GPGPU 1440. Inone embodiment a runtime library 1436 in system memory 1432 canfacilitate the compilation and/or execution of compiled code 1434B. Theprocessor 1412 can execute instructions for a compiler 1435 stored insystem memory 1432. The compiler 1435 can compile source code 1434A intocompiled code 1434B for execution by the processor 1412 and/or GPGPU1440. In one embodiment, the compiler 1435 is, or can include a shadercompiler to compiler shader programs specifically for execution by theGPGPU 1440.

Machine Learning Overview

A machine learning algorithm is an algorithm that can learn based on aset of data. Embodiments of machine learning algorithms can be designedto model high-level abstractions within a data set. For example, imagerecognition algorithms can be used to determine which of severalcategories to which a given input belong; regression algorithms canoutput a numerical value given an input; and pattern recognitionalgorithms can be used to generate translated text or perform text tospeech and/or speech recognition.

An exemplary type of machine learning algorithm is a neural network.There are many types of neural networks; a simple type of neural networkis a feedforward network. A feedforward network may be implemented as anacyclic graph in which the nodes are arranged in layers. Typically, afeedforward network topology includes an input layer and an output layerthat are separated by at least one hidden layer. The hidden layertransforms input received by the input layer into a representation thatis useful for generating output in the output layer. The network nodesare fully connected via edges to the nodes in adjacent layers, but thereare no edges between nodes within each layer. Data received at the nodesof an input layer of a feedforward network are propagated (i.e., “fedforward”) to the nodes of the output layer via an activation functionthat calculates the states of the nodes of each successive layer in thenetwork based on coefficients (“weights”) respectively associated witheach of the edges connecting the layers. Depending on the specific modelbeing represented by the algorithm being executed, the output from theneural network algorithm can take various forms.

Before a machine learning algorithm can be used to model a particularproblem, the algorithm is trained using a training data set. Training aneural network involves selecting a network topology, using a set oftraining data representing a problem being modeled by the network, andadjusting the weights until the network model performs with a minimalerror for all instances of the training data set. For example, during asupervised learning training process for a neural network, the outputproduced by the network in response to the input representing aninstance in a training data set is compared to the “correct” labeledoutput for that instance, an error signal representing the differencebetween the output and the labeled output is calculated, and the weightsassociated with the connections are adjusted to minimize that error asthe error signal is backward propagated through the layers of thenetwork. The network is considered “trained” when the errors for each ofthe outputs generated from the instances of the training data set areminimized.

The accuracy of a machine learning algorithm can be affectedsignificantly by the quality of the data set used to train thealgorithm. The training process can be computationally intensive and mayrequire a significant amount of time on a conventional general-purposeprocessor. Accordingly, parallel processing hardware is used to trainmany types of machine learning algorithms. This is particularly usefulfor optimizing the training of neural networks, as the computationsperformed in adjusting the coefficients in neural networks lendthemselves naturally to parallel implementations. Specifically, manymachine learning algorithms and software applications have been adaptedto make use of the parallel processing hardware within general-purposegraphics processing devices.

FIG. 15 is a generalized diagram of a machine learning software stack1500. A machine learning application 1502 can be configured to train aneural network using a training dataset or to use a trained deep neuralnetwork to implement machine intelligence. The machine learningapplication 1502 can include training and inference functionality for aneural network and/or specialized software that can be used to train aneural network before deployment. The machine learning application 1502can implement any type of machine intelligence including but not limitedto image recognition, mapping and localization, autonomous navigation,speech synthesis, medical imaging, or language translation.

Hardware acceleration for the machine learning application 1502 can beenabled via a machine learning framework 1504. The machine learningframework 1504 can provide a library of machine learning primitives.Machine learning primitives are basic operations that are commonlyperformed by machine learning algorithms Without the machine learningframework 1504, developers of machine learning algorithms would berequired to create and optimize the main computational logic associatedwith the machine learning algorithm, then re-optimize the computationallogic as new parallel processors are developed. Instead, the machinelearning application can be configured to perform the necessarycomputations using the primitives provided by the machine learningframework 1504. Exemplary primitives include tensor convolutions,activation functions, and pooling, which are computational operationsthat are performed while training a convolutional neural network (CNN).The machine learning framework 1504 can also provide primitives toimplement basic linear algebra subprograms performed by manymachine-learning algorithms, such as matrix and vector operations.

The machine learning framework 1504 can process input data received fromthe machine learning application 1502 and generate the appropriate inputto a compute framework 1506. The compute framework 1506 can abstract theunderlying instructions provided to the GPGPU driver 1508 to enable themachine learning framework 1504 to take advantage of hardwareacceleration via the GPGPU hardware 1510 without requiring the machinelearning framework 1504 to have intimate knowledge of the architectureof the GPGPU hardware 1510. Additionally, the compute framework 1506 canenable hardware acceleration for the machine learning framework 1504across a variety of types and generations of the GPGPU hardware 1510.

Machine Learning Neural Network Implementations

The computing architecture provided by embodiments described herein canbe configured to perform the types of parallel processing that isparticularly suited for training and deploying neural networks formachine learning. A neural network can be generalized as a network offunctions having a graph relationship. As is known in the art, there area variety of types of neural network implementations used in machinelearning. One exemplary type of neural network is the feedforwardnetwork, as previously described.

A second exemplary type of neural network is the Convolutional NeuralNetwork (CNN). A CNN is a specialized feedforward neural network forprocessing data having a known, grid-like topology, such as image data.Accordingly, CNNs are commonly used for compute vision and imagerecognition applications, but they also may be used for other types ofpattern recognition such as speech and language processing. The nodes inthe CNN input layer are organized into a set of “filters” (featuredetectors inspired by the receptive fields found in the retina), and theoutput of each set of filters is propagated to nodes in successivelayers of the network. The computations for a CNN include applying theconvolution mathematical operation to each filter to produce the outputof that filter. Convolution is a specialized kind of mathematicaloperation performed by two functions to produce a third function that isa modified version of one of the two original functions. Inconvolutional network terminology, the first function to the convolutioncan be referred to as the input, while the second function can bereferred to as the convolution kernel. The output may be referred to asthe feature map. For example, the input to a convolution layer can be amultidimensional array of data that defines the various color componentsof an input image. The convolution kernel can be a multidimensionalarray of parameters, where the parameters are adapted by the trainingprocess for the neural network.

Recurrent neural networks (RNNs) are a family of feedforward neuralnetworks that include feedback connections between layers. RNNs enablemodeling of sequential data by sharing parameter data across differentparts of the neural network. The architecture for a RNN includes cycles.The cycles represent the influence of a present value of a variable onits own value at a future time, as at least a portion of the output datafrom the RNN is used as feedback for processing subsequent input in asequence. This feature makes RNNs particularly useful for languageprocessing due to the variable nature in which language data can becomposed.

The figures described below present exemplary feedforward, CNN, and RNNnetworks, as well as describe a general process for respectivelytraining and deploying each of those types of networks. It will beunderstood that these descriptions are exemplary and non-limiting as toany specific embodiment described herein and the concepts illustratedcan be applied generally to deep neural networks and machine learningtechniques in general.

The exemplary neural networks described above can be used to performdeep learning. Deep learning is machine learning using deep neuralnetworks. The deep neural networks used in deep learning are artificialneural networks composed of multiple hidden layers, as opposed toshallow neural networks that include only a single hidden layer. Deeperneural networks are generally more computationally intensive to train.However, the additional hidden layers of the network enable multisteppattern recognition that results in reduced output error relative toshallow machine learning techniques.

Deep neural networks used in deep learning typically include a front-endnetwork to perform feature recognition coupled to a back-end networkwhich represents a mathematical model that can perform operations (e.g.,object classification, speech recognition, etc.) based on the featurerepresentation provided to the model. Deep learning enables machinelearning to be performed without requiring hand crafted featureengineering to be performed for the model. Instead, deep neural networkscan learn features based on statistical structure or correlation withinthe input data. The learned features can be provided to a mathematicalmodel that can map detected features to an output. The mathematicalmodel used by the network is generally specialized for the specific taskto be performed, and different models will be used to perform differenttask.

Once the neural network is structured, a learning model can be appliedto the network to train the network to perform specific tasks. Thelearning model describes how to adjust the weights within the model toreduce the output error of the network. Backpropagation of errors is acommon method used to train neural networks. An input vector ispresented to the network for processing. The output of the network iscompared to the desired output using a loss function and an error valueis calculated for each of the neurons in the output layer. The errorvalues are then propagated backwards until each neuron has an associatederror value which roughly represents its contribution to the originaloutput. The network can then learn from those errors using an algorithm,such as the stochastic gradient descent algorithm, to update the weightsof the of the neural network.

FIGS. 16A-16B illustrate an exemplary convolutional neural network. FIG.16A illustrates various layers within a CNN. As shown in FIG. 16A, anexemplary CNN used to model image processing can receive input 1602describing the red, green, and blue (RGB) components of an input image.The input 1602 can be processed by multiple convolutional layers (e.g.,first convolutional layer 1604, second convolutional layer 1606). Theoutput from the multiple convolutional layers may optionally beprocessed by a set of fully connected layers 1608. Neurons in a fullyconnected layer have full connections to all activations in the previouslayer, as previously described for a feedforward network. The outputfrom the fully connected layers 1608 can be used to generate an outputresult from the network. The activations within the fully connectedlayers 1608 can be computed using matrix multiplication instead ofconvolution. Not all CNN implementations are make use of fully connectedlayers 1608. For example, in some implementations the secondconvolutional layer 1606 can generate output for the CNN.

The convolutional layers are sparsely connected, which differs fromtraditional neural network configuration found in the fully connectedlayers 1608. Traditional neural network layers are fully connected, suchthat every output unit interacts with every input unit. However, theconvolutional layers are sparsely connected because the output of theconvolution of a field is input (instead of the respective state valueof each of the nodes in the field) to the nodes of the subsequent layer,as illustrated. The kernels associated with the convolutional layersperform convolution operations, the output of which is sent to the nextlayer. The dimensionality reduction performed within the convolutionallayers is one aspect that enables the CNN to scale to process largeimages.

FIG. 16B illustrates exemplary computation stages within a convolutionallayer of a CNN. Input to a convolutional layer 1612 of a CNN can beprocessed in three stages of a convolutional layer 1614. The threestages can include a convolution stage 1616, a detector stage 1618, anda pooling stage 1620. The convolution layer 1614 can then output data toa successive convolutional layer. The final convolutional layer of thenetwork can generate output feature map data or provide input to a fullyconnected layer, for example, to generate a classification value for theinput to the CNN.

In the convolution stage 1616 performs several convolutions in parallelto produce a set of linear activations. The convolution stage 1616 caninclude an affine transformation, which is any transformation that canbe specified as a linear transformation plus a translation. Affinetransformations include rotations, translations, scaling, andcombinations of these transformations. The convolution stage computesthe output of functions (e.g., neurons) that are connected to specificregions in the input, which can be determined as the local regionassociated with the neuron. The neurons compute a dot product betweenthe weights of the neurons and the region in the local input to whichthe neurons are connected. The output from the convolution stage 1616defines a set of linear activations that are processed by successivestages of the convolutional layer 1614.

The linear activations can be processed by a detector stage 1618. In thedetector stage 1618, each linear activation is processed by a non-linearactivation function. The non-linear activation function increases thenonlinear properties of the overall network without affecting thereceptive fields of the convolution layer. Several types of non-linearactivation functions may be used. One particular type is the rectifiedlinear unit (ReLU), which uses an activation function defined asf(x)=max (0,x), such that the activation is thresholded at zero.

The pooling stage 1620 uses a pooling function that replaces the outputof the second convolutional layer 1606 with a summary statistic of thenearby outputs. The pooling function can be used to introducetranslation invariance into the neural network, such that smalltranslations to the input do not change the pooled outputs. Invarianceto local translation can be useful in scenarios where the presence of afeature in the input data is more important than the precise location ofthe feature. Various types of pooling functions can be used during thepooling stage 1620, including max pooling, average pooling, and 12-normpooling. Additionally, some CNN implementations do not include a poolingstage. Instead, such implementations substitute and additionalconvolution stage having an increased stride relative to previousconvolution stages.

The output from the convolutional layer 1614 can then be processed bythe next layer 1622. The next layer 1622 can be an additionalconvolutional layer or one of the fully connected layers 1608. Forexample, the first convolutional layer 1604 of FIG. 16A can output tothe second convolutional layer 1606, while the second convolutionallayer can output to a first layer of the fully connected layers 1608.

FIG. 17 illustrates an exemplary recurrent neural network. In arecurrent neural network (RNN), the previous state of the networkinfluences the output of the current state of the network. RNNs can bebuilt in a variety of ways using a variety of functions. The use of RNNsgenerally revolves around using mathematical models to predict thefuture based on a prior sequence of inputs. For example, an RNN may beused to perform statistical language modeling to predict an upcomingword given a previous sequence of words. The illustrated RNN 1700 can bedescribed as having an input layer 1702 that receives an input vector,hidden layers 1704 to implement a recurrent function, a feedbackmechanism 1705 to enable a ‘memory’ of previous states, and an outputlayer 1706 to output a result. The RNN 1700 operates based ontime-steps. The state of the RNN at a given time step is influencedbased on the previous time step via the feedback mechanism 1705. For agiven time step, the state of the hidden layers 1704 is defined by theprevious state and the input at the current time step. An initial input(x1) at a first time step can be processed by the hidden layer 1704. Asecond input (x2) can be processed by the hidden layer 1704 using stateinformation that is determined during the processing of the initialinput (x1). A given state can be computed as s_t=f(Ux_t+Ws_(t−1)), whereU and W are parameter matrices. The function f is generally anonlinearity, such as the hyperbolic tangent function (Tanh) or avariant of the rectifier function f(x)=max (0,x). However, the specificmathematical function used in the hidden layers 1704 can vary dependingon the specific implementation details of the RNN 1700.

In addition to the basic CNN and RNN networks described, variations onthose networks may be enabled. One example RNN variant is the longshort-term memory (LSTM) RNN. LSTM RNNs are capable of learninglong-term dependencies that may be necessary for processing longersequences of language. A variant on the CNN is a convolutional deepbelief network, which has a structure similar to a CNN and is trained ina manner similar to a deep belief network. A deep belief network (DBN)is a generative neural network that is composed of multiple layers ofstochastic (random) variables. DBNs can be trained layer-by-layer usinggreedy unsupervised learning. The learned weights of the DBN can then beused to provide pre-train neural networks by determining an optimalinitial set of weights for the neural network.

FIG. 18 illustrates training and deployment of a deep neural network.Once a given network has been structured for a task the neural networkis trained using a training dataset 1802. Various training frameworkshave been developed to enable hardware acceleration of the trainingprocess. For example, the machine learning framework 1504 of FIG. 15 maybe configured as a training framework 1804. The training framework 1804can hook into an untrained neural network 1806 and enable the untrainedneural net to be trained using the parallel processing resourcesdescribed herein to generate a trained neural network 1808. To start thetraining process the initial weights may be chosen randomly or bypre-training using a deep belief network. The training cycle then beperformed in either a supervised or unsupervised manner.

Supervised learning is a learning method in which training is performedas a mediated operation, such as when the training dataset 1802 includesinput paired with the desired output for the input, or where thetraining dataset includes input having known output and the output ofthe neural network is manually graded. The network processes the inputsand compares the resulting outputs against a set of expected or desiredoutputs. Errors are then propagated back through the system. Thetraining framework 1804 can adjust to adjust the weights that controlthe untrained neural network 1806. The training framework 1804 canprovide tools to monitor how well the untrained neural network 1806 isconverging towards a model suitable to generating correct answers basedon known input data. The training process occurs repeatedly as theweights of the network are adjusted to refine the output generated bythe neural network. The training process can continue until the neuralnetwork reaches a statistically desired accuracy associated with atrained neural network 1808. The trained neural network 1808 can then bedeployed to implement any number of machine learning operations togenerate an inference result 814 based on input of new data 812.

Unsupervised learning is a learning method in which the network attemptsto train itself using unlabeled data. Thus, for unsupervised learningthe training dataset 1802 will include input data without any associatedoutput data. The untrained neural network 1806 can learn groupingswithin the unlabeled input and can determine how individual inputs arerelated to the overall dataset. Unsupervised training can be used togenerate a self-organizing map, which is a type of trained neuralnetwork 1808 capable of performing operations useful in reducing thedimensionality of data. Unsupervised training can also be used toperform anomaly detection, which allows the identification of datapoints in an input dataset that deviate from the normal patterns of thedata.

Variations on supervised and unsupervised training may also be employed.Semi-supervised learning is a technique in which in the training dataset1802 includes a mix of labeled and unlabeled data of the samedistribution. Incremental learning is a variant of supervised learningin which input data is continuously used to further train the model.Incremental learning enables the trained neural network 1808 to adapt tothe new data 1812 without forgetting the knowledge instilled within thenetwork during initial training.

Whether supervised or unsupervised, the training process forparticularly deep neural networks may be too computationally intensivefor a single compute node. Instead of using a single compute node, adistributed network of computational nodes can be used to accelerate thetraining process.

FIG. 19 is a block diagram illustrating distributed learning.Distributed learning is a training model that uses multiple distributedcomputing nodes to perform supervised or unsupervised training of aneural network. The distributed computational nodes can each include oneor more host processors and one or more of the general-purposeprocessing nodes. As illustrated, distributed learning can be performedmodel parallelism 1902, data parallelism 1904, or a combination of modeland data parallelism 1904.

In model parallelism 1902, different computational nodes in adistributed system can perform training computations for different partsof a single network. For example, each layer of a neural network can betrained by a different processing node of the distributed system. Thebenefits of model parallelism include the ability to scale toparticularly large models. Splitting the computations associated withdifferent layers of the neural network enables the training of verylarge neural networks in which the weights of all layers would not fitinto the memory of a single computational node. In some instances, modelparallelism can be particularly useful in performing unsupervisedtraining of large neural networks.

In data parallelism 1904, the different nodes of the distributed networkhave a complete instance of the model and each node receives a differentportion of the data. The results from the different nodes are thencombined. While different approaches to data parallelism are possible,data parallel training approaches all require a technique of combiningresults and synchronizing the model parameters between each node.Exemplary approaches to combining data include parameter averaging andupdate based data parallelism. Parameter averaging trains each node on asubset of the training data and sets the global parameters (e.g.,weights, biases) to the average of the parameters from each node.Parameter averaging uses a central parameter server that maintains theparameter data. Update based data parallelism is similar to parameteraveraging except

that instead of transferring parameters from the nodes to the parameterserver, the updates to the model are transferred. Additionally, updatebased data parallelism can be performed in a decentralized manner, wherethe updates are compressed and transferred between nodes.

Combined model and data parallelism 1906 can be implemented, forexample, in a distributed system in which each computational nodeincludes multiple GPUs. Each node can have a complete instance of themodel with separate GPUs within each node are used to train differentportions of the model.

Distributed training has increased overhead relative to training on asingle machine. However, the parallel processors and GPGPUs describedherein can each implement various techniques to reduce the overhead ofdistributed training, including techniques to enable high bandwidthGPU-to-GPU data transfer and accelerated remote data synchronization.

Exemplary Machine Learning Applications

Machine learning can be applied to solve a variety of technologicalproblems, including but not limited to computer vision, autonomousdriving and navigation, speech recognition, and language processing.Computer vision has traditionally been one of the most active researchareas for machine learning applications. Applications of computer visionrange from reproducing human visual abilities, such as recognizingfaces, to creating new categories of visual abilities. For example,computer vision applications can be configured to recognize sound wavesfrom the vibrations induced in objects visible in a video. Parallelprocessor accelerated machine learning enables computer visionapplications to be trained using significantly larger training datasetthan previously feasible and enables inferencing systems to be deployedusing low power parallel processors.

Parallel processor accelerated machine learning has autonomous drivingapplications including lane and road sign recognition, obstacleavoidance, navigation, and driving control. Accelerated machine learningtechniques can be used to train driving models based on datasets thatdefine the appropriate responses to specific training input. Theparallel processors described herein can enable rapid training of theincreasingly complex neural networks used for autonomous drivingsolutions and enables the deployment of low power inferencing processorsin a mobile platform suitable for integration into autonomous vehicles.

Parallel processor accelerated deep neural networks have enabled machinelearning approaches to automatic speech recognition (ASR). ASR includesthe creation of a function that computes the most probable linguisticsequence given an input acoustic sequence. Accelerated machine learningusing deep neural networks have enabled the replacement of the hiddenMarkov models (HMMs) and Gaussian mixture models (GMMs) previously usedfor ASR.

Parallel processor accelerated machine learning can also be used toaccelerate natural language processing. Automatic learning procedurescan make use of statistical inference algorithms to produce models thatare robust to erroneous or unfamiliar input. Exemplary natural languageprocessor applications include automatic machine translation betweenhuman languages.

The parallel processing platforms used for machine learning can bedivided into training platforms and deployment platforms. Trainingplatforms are generally highly parallel and include optimizations toaccelerate multi-GPU single node training and multi-node, multi-GPUtraining, while deployed machine learning (e.g., inferencing) platformsgenerally include lower power parallel processors suitable for use inproducts such as cameras, autonomous robots, and autonomous vehicles.

Sharing Register File Usage Between Fused Processing Resources

As described above, matrix multiplication operations have significantdata reuse, both spatially and temporally. Often, the performance ofmatrix multiplication operations is limited by the rate at which thematrix data can be fed into processing resources (e.g., processing unit,processing engine, execution resource, execution unit (EU), streamprocessors, streaming multiprocessor (SM), graphics multiprocessors,multi-core groups, compute unit, compute unit of graphics core) of aprocessor. The rate of data movement is limited by the bus width anddata rate of the buses that connect the processing resources and theshared local memory.

Described herein are systems and techniques to implement sharingregister file usage between fused processing resources, e.g., forperforming matrix multiplication operations. In some examples varioustechniques described herein may be used to minimize, or at least toreduce, the data movement required to perform matrix multiplicationoperations. Matrix multiplication operations involve a significantamount of data sharing between different processing resources that areworking on the matrix multiplication computation. In examples describedtwo fused processing resources mutually share one of the two matricesthat is required for the matrix multiplication. This reduces theduplication of the same data in the each of the register files, therebysaving storage space, and reduces the data bandwidth required from thelocal memory by only moving the data once, as opposed to moving ittwice—once for each EU.

FIG. 20 is a schematic illustration of a matrix multiplicationoperation, according to some embodiments. Referring to FIG. 20, a matrixmultiplication operation 2000 involves performing a matrixmultiplication operation of matrix A1 2010 with matrix B1 2020 to obtainthe resulting matrix C1 2030. In some examples a processing resource mayload the full matrix A1 2010 and the full matrix B1 2020 into registerfiles for the processing resource. In some examples the matrix A1 2010may be a 32×32 matrix and the matrix B1 2020 may also be a 32×32 matrix,such that the matrix multiplication operation results in matrix C1,which is also a 32×32 matrix. Assuming the matrices A1 2010 and B1 2020comprise 8-bit data elements and the registers are 32-byte registers,the matrix A1 2010 consumes 32 registers and the matrix B1 2020 consumes32 registers. The resulting matrix C1 2030 may comprise 32-bit dataelements, which requires 128 registers. Thus, the matrix multiplicationoperation depicted in FIG. 20 consumes a total of 192 registers whenexecuted on a single processing resource.

FIG. 21 is a schematic illustration of a matrix multiplicationoperation, according to some embodiments. Referring to FIG. 21, in someexamples the matrix A 2110 may be divided into a first portion 2112 anda second portion 2114. In some examples the first portion 2112represents half of the matrix A1 2110 and the second portion 2114 alsorepresents half of the matrix A1 2110. In some examples the matrixmultiplication operation may be divided between two processingresources. For example, the first portion 2112 of the matrix A1 2110 maybe loaded into a first processing resource and the second portion 2114of the matrix A1 2110 may be loaded into a second processing resource.During execution of the matrix multiplication operation, the matrix A12110 is shared across the two processing resources.

As illustrated in FIG. 21, each processing resource produces its uniqueoutput. The first processing resource performs a matrix multiplicationoperation of the first portion 2112 of the matrix A1 2110 with thematrix B1 2120, resulting in matrix C1 2130. The second processingresource performs a matrix multiplication operation of the secondportion 2114 of the matrix A1 2110 with the matrix B2 2125, resulting inmatrix C2 2135.

In some examples the matrix A1 2010 may be a 32×32 matrix and the matrixB1 2020 may also be a 32×32 matrix, such that the matrix multiplicationoperation results in matrix C1, which is also a 32×32 matrix. Assumingthe matrices A1 2010 and B1 2020 comprise 8-bit data elements and theregisters are 32-byte registers, the first portion 2112 of matrix A12110 consumes 16 registers and the matrix B1 2120 consumes 32 registers.The resulting matrix C1 2130 may comprise 32-bit data elements, whichrequires 128 registers. Thus, the matrix multiplication operationdepicted in FIG. 21 consumes a total of 176 registers when executedshared between two processing resources, thereby saving register filesfor other data. The matrix multiplication operation of the secondportion 2114 of matrix A1 2110 with matrix B 2125 also consumes a totalof 176 registers. Also, the matrix A1 2110 is only read into theregister files from local memory or cache once, thereby savingbandwidth.

FIG. 22 is a block diagram which illustrates components of an apparatusto support matrix multiplication operations, according to someembodiments described herein. Referring to FIG. 22, data from an L1 orL3 cache arrives to HDC 2210 via a data bus that operates at 64 Bytesper clock cycle. HDC 2210 is communicatively coupled to one or morememory arbiters such as MA 0 2230 and MA1 2235 by a data bus thatoperates at 32 Bytes per clock cycle. A sampler 2215 is communicativelycoupled to one or more memory arbiters such as MA 0 2230 and MA1 2235 bytwo data busses that operate at 32 Bytes per clock cycle. A shared localmemory (SLM) module 2220 is communicatively coupled to one or morememory arbiters such as MA 0 2230 and MA1 2235 by two data busses thatoperate at 32 Bytes per clock cycle. The first memory arbiter MA 0 2230is communicatively coupled to a first fused processing resource (EU)pair 2240 and the second memory arbiter MA 0 2230 is communicativelycoupled to a second fused processing resource (EU) pair 2250. In someexamples the first EU pair 2240 comprises a first EU 2242 that is fusedto a second EU 2244. Similarly, the second EU pair 2250 comprises firstEU 2252 that is fused to a second EU 2254.

FIG. 23 is a block diagram which illustrates components of an apparatusto support matrix multiplication operations, according to someembodiments described herein. More particularly, FIG. 23 illustrates howtwo fused executed units indicated by EU 0 2310 and EU 1 2320 accessshared registers. Referring to FIG. 23, a previous accumulation resultis input to source register 2312 of EU 2310. Similarly, a previousaccumulation result is input to source register 2322 of EU 2320. Forconvolutional computations the weights may be cached locally to bereused across instructions. The source register Scr1 for each EU may beloaded with unique values corresponding to matrix B in the matrixmultiplication operation.

In some examples the contents of the source register Scr2 may be loadedwith the values corresponding to Matrix A in the matrix multiplicationoperation and shared by both EU 0 2310 and EU 1 2320. For example, inresponse to an instruction to initiate a matrix multiplicationoperation, the source register 2314 of EU 0 2310 may be loaded with thefirst portion 2112 of matrix A 2110 depicted in FIG. 21, and the sourceregister 2324 of EU 1 2320 may be loaded with the second portion 2114 ofmatrix A 210 depicted in FIG. 21. The contents of source registers 2314and 2324 may be broadcast across the processing resources, such that thecontents of both source registers 2314 and 2324 are accessible to bothprocessing resources during the matrix multiplication operation.

FIG. 24 is a flowchart which illustrates operations in a method tosupport matrix multiplication operations, according to some embodimentsdescribed herein. Referring to FIG. 24, in some examples the operationsdepicted in FIG. 24 may be implemented as logic instructions which maybe stored on a non-transient computer-readable medium and executed byone or more processing devices. For example, in the apparatus 2200depicted in FIG. 22 the operations of FIG. 24 may be implemented by thememory arbiters 2230, 2235, alone or in combination with the fused EUpairs 2240, 2250.

Referring to FIG. 24, at operation 2410 an instruction to initiate amatrix multiplication operation is received. In some examples theinstruction may be received in the apparatus 2200 depicted in FIG. 22.In some examples the instruction may be implemented as a dot productaccumulate systolic-wide (dpasW) instruction.

In response to the instruction, at operation 2415, a first set of matrixdata is written to a first set of registers. In the examples depicted inFIGS. 21-23, the first set of matrix data may be written to one of theshared source registers 2314, 2324 which are shared between EU0 2310 andEU1 2320. At operation 2420 a first portion of the first set of matrixdata is allocated to a first processing resource, and at operation 2425a second portion of the first set of matrix data is allocated to asecond processing resource. In the example depicted in FIG. 23, thefirst portion 2112 of matrix A2110 may be allocated to EU0 2310 and thesecond portion 2114 of matrix A 2110 may be allocated to EU1 2320.

At operation 2430 a second set of matrix multiplication data is writtento a second set of registers. In the example depicted in FIGS. 21-23 thememory arbiter 2230 may cause the matrix B1 2020 to be written to asecond set of registers in the fused EU pair 2240. Similarly, the memoryarbiter 2235 may cause the matrix B1 2020 to be written to a second setof registers in the fused EU pair 2250. Thus, the fused EU pairs 2240,2250 are loaded with the matrix data required to implement the matrixmultiplication operations:C1=A1×B1  EQ 1:C2=A2×B2  EQ2:

At operation 2435 a signal is generated which causes the matrixmultiplication operations depicted in EQ1 and EQ2 to be executed sharedprocessing resources. In the example depicted in FIGS. 21-23 the matrixmultiplication operation of EQ1 may be performed by the fused EU pair2240, while the matrix multiplication operation of EQ2 may be performedby the second EU pair 2250.

At operation 2240 the output of the matrix multiplication operation maybe stored in a third set of registers. In the example depicted in FIGS.21-23 the matrix C1 of EQ1 may be stored in a third set of registers ofthe fused EU pair 2240, while the matrix C2 of EQ2 may be stored in athird set of registers of the second EU pair 2250.

FIG. 25 is a block diagram of a computing device 2500 including agraphics processor 2504, according to an embodiment. The computingdevice 2500 can be a computing device as described herein, such as thedata processing system 100 as in of FIG. 1. The computing device 2500may also be or be included within a communication device such as aset-top box (e.g., Internet-based cable television set-top boxes, etc.),global positioning system (GPS)-based devices, etc. The computing device2500 may also be or be included within mobile computing devices such ascellular phones, smartphones, personal digital assistants (PDAs), tabletcomputers, laptop computers, e-readers, smart televisions, televisionplatforms, wearable devices (e.g., glasses, watches, bracelets,smartcards, jewelry, clothing items, etc.), media players, etc. Forexample, in one embodiment, the computing device 2500 includes a mobilecomputing device employing an integrated circuit (“IC”), such as systemon a chip (“SoC” or “SOC”), integrating various hardware and/or softwarecomponents of computing device 2500 on a single chip.

The computing device 2500 includes a graphics processor 2504. Thegraphics processor 2504 represents any graphics processor describedherein. The graphics processor includes one or more graphics engine(s),graphics processor cores, and other graphics execution resources asdescribed herein. Such graphics execution resources can be presented inthe forms including but not limited to processing resources, shaderengines, fragment processors, vertex processors, streamingmultiprocessors, graphics processor clusters, or any collection ofcomputing resources suitable for the processing of graphics and imageresources.

In one embodiment the graphics processor 2504 includes a cache 2514,which can be a single cache or divided into multiple segments of cachememory, including but not limited to any number of L1, L2, L3, or L4caches, render caches, depth caches, sampler caches, and/or shader unitcaches. In one embodiment, the graphics processor 2504 includes ascheduler 2524. The graphics processor 2504 can additionally include acommand streamer 2526, a thread dispatcher 2534, andbarrier/synchronization logic 2536, in addition to a GPGPU engine 2544that includes hardware logic to perform graphics processing andgeneral-purpose instruction execution as described herein.

As illustrated, in one embodiment, and in addition to the graphicsprocessor 2504, the computing device 2500 may further include any numberand type of hardware components and/or software components, including,but not limited to an application processor 2506, memory 2508, andinput/output (I/O) sources 2510. The application processor 2506 caninteract with a hardware graphics pipeline, as illustrated withreference to FIG. 3, to share graphics pipeline functionality. Processeddata is stored in a buffer in the hardware graphics pipeline and stateinformation is stored in memory 2508. The resulting data can betransferred to a display controller for output via a display device,such as the display device 323 of FIG. 3. The display device may be ofvarious types, such as Cathode Ray Tube (CRT), Thin Film Transistor(TFT), Liquid Crystal Display (LCD), Organic Light Emitting Diode (OLED)array, etc., and may be configured to display information to a user viaa graphical user interface.

The application processor 2506 can include one or processors, such asprocessor(s) 102 of FIG. 1 and may be the central processing unit (CPU)that is used at least in part to execute an operating system (OS) 2502for the computing device 2500. The OS 2502 can serve as an interfacebetween hardware and/or physical resources of the computer device 2500and one or more users. The OS 2502 can include graphics driver logic2522, such as the user mode graphics driver 1026 and/or kernel modegraphics driver 1029 of FIG. 10.

It is contemplated that in some embodiments the graphics processor 2504may exist as part of the application processor 2506 (such as part of aphysical CPU package) in which case, at least a portion of the memory2508 may be shared by the application processor 2506 and graphicsprocessor 2504, although at least a portion of the memory 2508 may beexclusive to the graphics processor 2504, or the graphics processor 2504may have a separate store of memory. The memory 2508 may comprise apre-allocated region of a buffer (e.g., framebuffer); however, it shouldbe understood by one of ordinary skill in the art that the embodimentsare not so limited, and that any memory accessible to the lower graphicspipeline may be used. The memory 2508 may include various forms ofrandom access memory (RAM) (e.g., SDRAM, SRAM, etc.) comprising anapplication that makes use of the graphics processor 2504 to render adesktop or 3D graphics scene. A memory controller can be used to accessdata in the memory 2508 and forward the data to the graphics processor2504 for graphics pipeline processing. The memory 2508 may be madeavailable to other components within the computing device 2500. Forexample, any data (e.g., input graphics data) received from various I/Osources 2510 of the computing device 2500 can be temporarily queued intomemory 2508 prior to their being operated upon by one or moreprocessor(s) (e.g., application processor 2506) in the implementation ofa software program or application. Similarly, data that a softwareprogram determines should be sent from the computing device 2500 to anoutside entity through one of the computing system interfaces, or storedinto an internal storage element, is often temporarily queued in memory2508 prior to its being transmitted or stored.

The I/O sources can include devices such as touchscreens, touch panels,touch pads, virtual or regular keyboards, virtual or regular mice,ports, connectors, network devices, or the like. Additionally, the I/Osources 2510 may include one or more I/O devices that are implementedfor transferring data to and/or from the computing device 2500 (e.g., anetworking adapter); or, for a large-scale non-volatile storage withinthe computing device 2500 (e.g., hard disk drive). User input devices,including alphanumeric and other keys, may be used to communicateinformation and command selections to graphics processor 2504. Anothertype of user input device is cursor control, such as a mouse, atrackball, a touchscreen, a touchpad, or cursor direction keys tocommunicate direction information and command selections to GPU and tocontrol cursor movement on the display device. Camera and microphonearrays of the computer device 2500 may be employed to observe gestures,record audio and video and to receive and transmit visual and audiocommands.

I/O sources 2510 configured as network interfaces can provide access toa network, such as a LAN, a wide area network (WAN), a metropolitan areanetwork (MAN), a personal area network (PAN), Bluetooth, a cloudnetwork, a cellular or mobile network (e.g., 3^(rd) Generation (3G),4^(th) Generation (4G), etc.), an intranet, the Internet, etc. Networkinterface(s) may include, for example, a wireless network interfacehaving one or more antenna(e). Network interface(s) may also include,for example, a wired network interface to communicate with remotedevices via network cable, which may be, for example, an Ethernet cable,a coaxial cable, a fiber optic cable, a serial cable, or a parallelcable.

Network interface(s) may provide access to a LAN, for example, byconforming to IEEE 802.11 standards, and/or the wireless networkinterface may provide access to a personal area network, for example, byconforming to Bluetooth standards. Other wireless network interfacesand/or protocols, including previous and subsequent versions of thestandards, may also be supported. In addition to, or instead of,communication via the wireless LAN standards, network interface(s) mayprovide wireless communication using, for example, Time Division,Multiple Access (TDMA) protocols, Global Systems for MobileCommunications (GSM) protocols, Code Division, Multiple Access (CDMA)protocols, and/or any other type of wireless communications protocols.

It is to be appreciated that a lesser or more equipped system than theexample described above may be preferred for certain implementations.Therefore, the configuration of the computing device 2500 may vary fromimplementation to implementation depending upon numerous factors, suchas price constraints, performance requirements, technologicalimprovements, or other circumstances. Examples include (withoutlimitation) a mobile device, a personal digital assistant, a mobilecomputing device, a smartphone, a cellular telephone, a handset, aone-way pager, a two-way pager, a messaging device, a computer, apersonal computer (PC), a desktop computer, a laptop computer, anotebook computer, a handheld computer, a tablet computer, a server, aserver array or server farm, a web server, a network server, an Internetserver, a work station, a mini-computer, a main frame computer, asupercomputer, a network appliance, a web appliance, a distributedcomputing system, multiprocessor systems, processor-based systems,consumer electronics, programmable consumer electronics, television,digital television, set top box, wireless access point, base station,subscriber station, mobile subscriber center, radio network controller,router, hub, gateway, bridge, switch, machine, or combinations thereof.

The following clauses and/or examples pertain to specific embodiments orexamples thereof. Specifics in the examples may be used anywhere in oneor more embodiments. The various features of the different embodimentsor examples may be variously combined with some features included andothers excluded to suit a variety of different applications. Examplesmay include subject matter such as a method, means for performing actsof the method, at least one machine-readable medium includinginstructions that, when performed by a machine cause the machine toperform acts of the method, or of an apparatus or system according toembodiments and examples described herein. Various components can be ameans for performing the operations or functions described.

Example 1 is an apparatus, comprising a plurality of processingresources including a first processing resource and a second processingresource; a shared local memory communicatively coupled to the firstprocessing resource and the second processing resource; and a processorto receive an instruction to initiate a matrix multiplication operation;write a first set of matrix data into a first set of registers; andshare the first set of matrix data between the first processing resourceand the second processing resource for use in the matrix multiplicationoperation.

Example 2 may comprise the subject matter of example 1, wherein thefirst processing resource and the second processing resource are fused.

Example 3 may comprise the subject matter of any one of examples 1-2,the processor to allocate a first portion of the first set of matrixdata to the first processing resource and a second portion of the firstset of matrix data to the second processing resource.

Example 4 may comprise the subject matter of any one of examples 1-3,the processor to write a second set of matrix data into a second set ofregisters.

Example 5 may comprise the subject matter of any one of examples 1-4,the processor to generate a signal to execute the matrix multiplicationoperation using the first processing resource and the second processingresource.

Example 6 may comprise the subject matter of any one of examples 1-5,wherein the first processing resource generates a first output whichrepresents a matrix multiplication of the first portion of the first setof matrix data and the second set of matrix data; and the secondprocessing resource generates a second output which represents a matrixmultiplication of the second portion of the first set of matrix data andthe second set of matrix data.

Example 7 may comprise the subject matter of any one of examples 1-6,the processor to store the first output and the second output in a thirdset of registers

Example 8 is a non-transitory machine readable medium storinginstructions which, when executed by one or more processors, cause theone or more processors to receive an instruction to initiate a matrixmultiplication operation on a plurality of processing resourcesincluding a first processing resource and a second processing resource;write a first set of matrix data into a first set of registers of ashared local memory communicatively coupled to the first processingresource and the second processing resource; and share the first set ofmatrix data between the first processing resource and the secondprocessing resource for use in the matrix multiplication operation.

Example 9 may comprise the subject matter of example 8, wherein thefirst processing resource and the second processing resource are fused.

Example 10 may comprise the subject matter of any one of examples 8-9,further comprising instructions which configure the processor toallocate a first portion of the first set of matrix data to the firstprocessing resource and a second portion of the first set of matrix datato the second processing resource.

Example 11 may comprise the subject matter of any one of examples 8-10,further comprising instructions which configure the processor to write asecond set of matrix data into a second set of registers.

Example 12 may comprise the subject matter of any one of examples 8-11,further comprising instructions which configure the processor togenerate a signal to execute the matrix multiplication operation usingthe first processing resource and the second processing resource.

Example 13 may comprise the subject matter of any one of examples 8-12,wherein the first processing resource generates a first output whichrepresents a matrix multiplication of the first portion of the first setof matrix data and the second set of matrix data; and the secondprocessing resource generates a second output which represents a matrixmultiplication of the second portion of the first set of matrix data andthe second set of matrix data.

Example 14 may comprise the subject matter of any one of examples 8-12,further comprising instructions which configure the processor to storethe first output and the second output in a third set of registers.

Example 15 is a computer-implemented method, comprising receiving aninstruction to initiate a matrix multiplication operation on a pluralityof processing resources including a first processing resource and asecond processing resource; writing a first set of matrix data into afirst set of registers of a shared local memory communicatively coupledto the first processing resource and the second processing resource; andsharing the first set of matrix data between the first processingresource and the second processing resource for use in the matrixmultiplication operation.

Example 16 may comprise the subject matter of example 15 wherein thefirst processing resource and the second processing resource are fused.

Example 17 may comprise the subject matter of any one of examples 15-16,further comprising allocating a first portion of the first set of matrixdata to the first processing resource and a second portion of the firstset of matrix data to the second processing resource.

Example 18 may comprise the subject matter of any one of examples 15-17,further comprising writing a second set of matrix data into a second setof registers.

Example 19 may comprise the subject matter of any one of examples 15-18,further comprising generating a signal to execute the matrixmultiplication operation using the first processing resource and thesecond processing resource.

Example 20 may comprise the subject matter of any one of examples 15-19,wherein the first processing resource generates a first output whichrepresents a matrix multiplication of the first portion of the first setof matrix data and the second set of matrix data; and the secondprocessing resource generates a second output which represents a matrixmultiplication of the second portion of the first set of matrix data andthe second set of matrix data.

Example 21 may comprise the subject matter of any one of examples 15-20,further comprising storing the first output and the second output in athird set of registers.

Embodiments may be provided, for example, as a computer program productwhich may include one or more machine-readable media having storedthereon machine-executable instructions that, when executed by one ormore machines such as a computer, network of computers, or otherelectronic devices, may result in the one or more machines carrying outoperations in accordance with embodiments described herein. Amachine-readable medium may include, but is not limited to, floppydiskettes, optical disks, CD-ROMs (Compact Disc-Read Only Memories), andmagneto-optical disks, ROMs, RAMs, EPROMs (Erasable Programmable ReadOnly Memories), EEPROMs (Electrically Erasable Programmable Read OnlyMemories), magnetic or optical cards, flash memory, or other type ofmedia/machine-readable medium suitable for storing machine-executableinstructions.

Moreover, embodiments may be downloaded as a computer program product,wherein the program may be transferred from a remote computer (e.g., aserver) to a requesting computer (e.g., a client) by way of one or moredata signals embodied in and/or modulated by a carrier wave or otherpropagation medium via a communication link (e.g., a modem and/ornetwork connection).

Those skilled in the art will appreciate from the foregoing descriptionthat the broad techniques of the embodiments can be implemented in avariety of forms. Therefore, while the embodiments have been describedin connection with particular examples thereof, the true scope of theembodiments should not be so limited since other modifications willbecome apparent to the skilled practitioner upon a study of thedrawings, specification, and following claims.

What is claimed is:
 1. An apparatus, comprising: a plurality ofprocessing resources including a first processing resource and a secondprocessing resource; a shared local memory communicatively coupled tothe first processing resource by a first data bus and the secondprocessing resource by a second data bus; and a first memory arbitercommunicatively coupled to the shared local memory and to the firstprocessing resource and the second processing resource; and a processorto: receive an instruction to initiate a matrix multiplicationoperation; cause the first memory arbiter to write a first set of matrixdata from the shared local memory into a first set of registers; andshare the first set of matrix data between the first processing resourceand the second processing resource for use in the matrix multiplicationoperation.
 2. The apparatus of claim 1, wherein the first processingresource and the second processing resource are fused.
 3. The apparatusof claim 2, the processor to: allocate a first portion of the first setof matrix data to the first processing resource and a second portion ofthe first set of matrix data to the second processing resource.
 4. Theapparatus of claim 3, the processor to: write a second set of matrixdata into a second set of registers.
 5. The apparatus of claim 4, theprocessor to: generate a signal to execute the matrix multiplicationoperation using the first processing resource and the second processingresource.
 6. The apparatus of claim 5, wherein: the first processingresource generates a first output which represents a matrixmultiplication of the first portion of the first set of matrix data andthe second set of matrix data; and the second processing resourcegenerates a second output which represents a matrix multiplication ofthe second portion of the first set of matrix data and the second set ofmatrix data.
 7. The apparatus of claim 6, the processor to: store thefirst output and the second output in a third set of registers.
 8. Anon-transitory machine readable medium storing instructions which, whenexecuted by one or more processors, cause the one or more processors to:receive an instruction to initiate a matrix multiplication operation ona plurality of processing resources including a first processingresource and a second processing resource; cause a first memory arbitercommunicatively coupled to the shared local memory and to the firstprocessing resource and the second processing resource to write a firstset of matrix data into a first set of registers of a shared localmemory communicatively coupled to the first processing resource and thesecond processing resource; and share the first set of matrix databetween the first processing resource and the second processing resourcefor use in the matrix multiplication operation.
 9. The non-transitorymachine readable medium of claim 8, wherein the first processingresource and the second processing resource are fused.
 10. Thenon-transitory machine readable medium of claim 9, further comprisinginstructions which configure the processor to: allocate a first portionof the first set of matrix data to the first processing resource and asecond portion of the first set of matrix data to the second processingresource.
 11. The non-transitory machine readable medium of claim 8,further comprising instructions which configure the processor to: writea second set of matrix data into a second set of registers.
 12. Thenon-transitory machine readable medium of claim 11, further comprisinginstructions which configure the processor to: generate a signal toexecute the matrix multiplication operation using the first processingresource and the second processing resource.
 13. The non-transitorymachine readable medium of claim 12, wherein: the first processingresource generates a first output which represents a matrixmultiplication of the first portion of the first set of matrix data andthe second set of matrix data; and the second processing resourcegenerates a second output which represents a matrix multiplication ofthe second portion of the first set of matrix data and the second set ofmatrix data.
 14. The non-transitory machine readable medium of claim 13,further comprising instructions which configure the processor to: storethe first output and the second output in a third set of registers. 15.A computer-implemented method, comprising: receiving an instruction toinitiate a matrix multiplication operation on a plurality of processingresources including a first processing resource and a second processingresource; causing a first memory arbiter communicatively coupled to theshared local memory and to the first processing resource and the secondprocessing resource to write a first set of matrix data into a first setof registers of a shared local memory communicatively coupled to thefirst processing resource and the second processing resource; andsharing the first set of matrix data between the first processingresource and the second processing resource for use in the matrixmultiplication operation.
 16. The method of claim 15, wherein the firstprocessing resource and the second processing resource are fused. 17.The method of claim 16, further comprising: allocating a first portionof the first set of matrix data to the first processing resource and asecond portion of the first set of matrix data to the second processingresource.
 18. The method of claim 15, further comprising: writing asecond set of matrix data into a second set of registers.
 19. The methodof claim 18, further comprising: generating a signal to execute thematrix multiplication operation using the first processing resource andthe second processing resource.
 20. The method of claim 19, wherein: thefirst processing resource generates a first output which represents amatrix multiplication of the first portion of the first set of matrixdata and the second set of matrix data; and the second processingresource generates a second output which represents a matrixmultiplication of the second portion of the first set of matrix data andthe second set of matrix date.
 21. The method of claim 20, furthercomprising: storing the first output and the second output in a thirdset of registers.